Process to fabricate integrated MWIR emitter
View Patent ↗A device for medium wavelength infrared emission and a method for the manufacture thereof is provided. The device has a semiconductor substrate; a passive hermetic barrier disposed upon the substrate, and an emitter element disposed within said hermetic barrier; and a mirror.
1. A method comprising:
etching a semiconductive substrate to form a well;
after etching the semiconductor substrate to form the well, applying a barrier layer on the semiconductive substrate;
applying a mold layer on the barrier layer;
etching the mold layer to at least partially expose the barrier layer and to create at least one emitter mold;
depositing an emitter material in the emitter mold and on the barrier layer exposed by said etching the mold layer; and
removing the mold layer.
2. The method of claim 1 , further comprising:
removing a portion of the barrier layer to expose a portion of the semiconductive substrate; and
etching a well into the portion of the semiconductive substrate exposed by said removing a portion of the barrier layer.
3. The method of claim 1 , wherein the barrier layer comprises at least one of boron nitride or silicon nitride.
4. The method of claim 1 , wherein the mold layer comprises silicon dioxide.
5. The method of claim 1 , wherein the emitter material comprises at least one of tungsten, silicon carbide, or carbon and alloys thereof.
6. The method of claim 1 , further comprising applying an insulation layer to the emitter material.
7. The method of claim 6 , further comprising depositing a reflective coating on at least a portion of the insulation layer.
8. A method comprising:
disposing a first insulation layer over a semiconductive substrate;
disposing an emitter material over a first portion of the first insulation layer;
removing a second portion of the first insulation layer to expose a portion of the semiconductive substrate;
creating a well in the portion of the semiconductive substrate exposed by said removing a second portion of the first insulation layer;
disposing a second insulation layer over the emitter material and the well;
disposing a reflective layer over at least a portion of the second insulation layer; and
creating at least one via opening in the second insulation layer to expose the emitter material.
9. The method of claim 8 , further comprising:
disposing a mold layer over the first insulation layer;
patterning the mold layer to expose the first portion of the first insulation layer; and
disposing the emitter material in the mold layer.
10. The method of claim 9 , further comprising removing the mold layer.
11. A method comprising:
disposing a first insulation layer over a semiconductive substrate;
disposing an emitter material over a first portion of the first insulation layer;
removing a second portion of the first insulation layer to expose a portion of the semiconductive substrate;
disposing a second insulation layer over the emitter material;
disposing a reflective layer over at least a portion of the second insulation layer; and
creating at least one via opening in the second insulation layer to expose the emitter material.
12. The method of claim 11 , further comprising:
disposing a mold layer over the first insulation layer prior to said disposing an emitter material; and
patterning the mold layer to expose the first portion of the first insulation layer, wherein the emitter material is disposed over the first portion of the first insulation layer exposed by said patterning of the mold layer.
13. The method of claim 12 , further comprising removing the mold layer.
14. The method of claim 11 , further comprising creating a well in the portion of the semiconductive substrate exposed by said removing a second portion of the first insulation layer.
15. A method comprising:
etching a well in a semiconductive substrate;
after etching the well in the semiconductor substrate, disposing a first insulation layer over the semiconductive substrate;
disposing an emitter material over a first portion of the first insulation layer;
disposing a mold layer over the first insulation layer prior to said disposing an emitter material;
patterning the mold layer to expose the first portion of the first insulation layer, wherein the emitter material is disposed over the first portion of the first insulation layer exposed by said patterning of the mold layer; and
removing a second portion of the first insulation layer to expose a portion of the semiconductive substrate.
16. The method of claim 15 , further comprising removing the mold layer.