Electron bombarded image sensor array device and its manufacturing method
View Patent ↗The invention relates to an electron bombarded image sensor array device comprising a vacuum chamber having a photocathode capable of releasing electrons into said vacuum chamber when exposed to light impinging on said photocathode, a photocathode capable of releasing electrons into said vacuum chamber when exposed to light impinging on said photocathode, electric field means for accelerating said released electrons from said photocathode towards an anode spaced apart from said photocathode in a facing relationship to receive an electron image from said photocathode, said anode being constructed as a back-thinned image sensor array having electric connecting pads distributed according to a pattern along the surface area of said sensor facing away from said photocathode, a carrier on which said image sensor array is mounted, said carrier having electric connecting pads distributed according to a pattern to feed electric signals from said image sensor array outside said vacuum chamber and electric connecting means for electrically connecting at least one of said electric connecting pads of said image sensor array with at least one of said electric connecting pads of said carrier.
1. An electron bombarded image sensor array device comprising a vacuum chamber having
a photocathode capable of releasing electrons into said vacuum chamber when exposed to light impinging on said photocathode,
electric field means for accelerating said released electrons from said photocathode towards an anode spaced apart from said photocathode in a facing relationship to receive an electron image from said photocathode,
said anode being constructed as a thinned image sensor array having electric connecting pads distributed according to a pattern along the surface area of said sensor facing away from said photocathode;
a carrier on which said image sensor array is mounted,
said carrier having electric connecting pads distributed according to a pattern to feed electric signals from said image sensor array outside said vacuum chamber towards signal processing means outside the vacuum chamber; and
electric connecting means for electrically connecting at least one of said electric connecting pads of said image sensor array with at least one of said electric connecting pads of said carrier, characterized in that said electric connecting pads of said carrier are distributed along a surface area of said carrier facing away from said image sensor array.
2. An electron bombarded image sensor array device according to claim 1 , characterized in that said surface area of said carrier being identical to the surface area of said image sensor array.
3. An electron bombarded image sensor array device according to claim 2 , characterized in that said image sensor array and said carrier having identical surface area dimensions.
4. An electron bombarded image sensor array device according to claim 1 , characterized in that said surface area of said carrier being larger than the surface area of said image sensor array.
5. An electron bombarded image sensor array device according to claim 4 , characterized in that said electric connecting means comprise first auxiliary electric connecting pads distributed according to a first auxiliary pattern, said first auxiliary pattern being equal to the pattern of said electric connecting pads of said image sensor array.
6. An electron bombarded image sensor array device according to claim 5 , characterized in that said first auxiliary electric connecting pads are distributed along the surface area of said carrier facing towards said image sensor array.
7. An electron bombarded image sensor array device according to claim 5 , characterized in that said first auxiliary electric connecting pads are distributed along the surface area of said carrier facing away from said image sensor array.
8. An electron bombarded image sensor array device according to claim 5 , characterized in that said electric connecting means comprise second auxiliary electric connecting pads distributed according to a second auxiliary pattern along the surface area of said carrier facing towards said image sensor array, said second auxiliary pattern being equal to the pattern of said electric connecting pads of said carrier.
9. An electron bombarded image sensor array device according to claim 8 , characterized in that second auxiliary electric connecting pads are distributed along the surface area of said carrier facing towards said image sensor array.
10. An electron bombarded image sensor array device according to claim 5 , characterized in that said electric connecting means comprise electric connecting leads for connecting said first auxiliary electric connecting pads with said second auxiliary electric connecting pads and/or said electric connecting pads of said carrier.
11. An electron bombarded image sensor array device according to claim 10 , characterized in that said electric connecting leads extend at least partly in a direction parallel to the plane of the carrier.
12. An electron bombarded image sensor array device according to claim 10 , characterized in that said electric connecting leads extend at least partly in a direction perpendicular to the plane of the carrier.
13. An electron bombarded image sensor array device according to claim 1 , characterized in that the carrier forms an integral part of the vacuum chamber.
14. An electron bombarded image sensor array device according to claim 1 , characterized in that the carrier is electrically mounted to a vacuum header, said vacuum header forming an integral part of the vacuum chamber.