IP Library Granted Patent US 7,604,476
Granted Patent B2
US 7,604,476 · App. 11/923,103 · Granted Oct 20, 2009

Hot runner nozzle system

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Quick Facts
Patent No.
US 7,604,476
App. No.
11/923,103
Granted
Oct 20, 2009
Kind
B2
Abstract

Disclosed is a hot-runner nozzle system, including: (i) a nozzle housing being configured to convey a molten molding material, (ii) a sieve being coupled with the nozzle housing, (iii) a nozzle tip being securely coupled relative to the sieve, and (iv) a retainer securely extending from the sieve, the retainer connecting with the nozzle tip.

Claims (87)

1. A hot-runner nozzle system, comprising:

a nozzle housing being configured to convey a molten molding material;

a sieve being coupled with the nozzle housing;

a separate nozzle tip being securely coupled relative to the sieve; and

a retainer securely extending through the sieve, the retainer connecting the nozzle tip to the sieve.

2. The hot-runner nozzle system of claim 1 , wherein:

the nozzle tip is interactable with a mold cavity being defined by a mold;

the nozzle housing is connectable with a melt passageway associated with a manifold of a hot runner, the nozzle housing includes:

an entrance being connectable with the melt passageway associated with the manifold of the hot runner, and

an exit; and

the sieve couples with the exit of the nozzle housing.

3. The hot-runner nozzle system of claim 1 , wherein:

the nozzle tip, includes:

a copper alloy being mated to a forward face of a center portion of the sieve.

4. The hot-runner nozzle system of claim 1 , wherein:

the nozzle tip includes:

a bore being configured to permit the nozzle tip to be securely joined with the retainer, the retainer being configured to be received in the bore.

5. The hot-runner nozzle system of claim 1 , wherein:

the sieve is configured to:

accommodate a device, and

route a wire to the device, the wire being connectable to the device.

6. The hot-runner nozzle system of claim 1 , wherein:

the nozzle tip is configured to:

accommodate a device, and

route a wire to the device, the wire being connectable to the device.

7. The hot-runner nozzle system of claim 1 , wherein:

the sieve is threadably joined with the nozzle housing so that a primary sealing interface and a secondary sealing interface may be established between the sieve and an exit associated with the nozzle housing.

8. The hot-runner nozzle system of claim 1 , wherein:

the sieve includes:

a gate-contact portion being contactable against a mold insert, the mold insert leading to a mold cavity being defined by a mold so that a gate-sealing surface may be established between:

the gate-contact portion, and

the mold insert leading to the mold cavity.

9. The hot-runner nozzle system of claim 1 , wherein:

the sieve includes:

a plurality of passages being configured to convey the molten molding material through the sieve.

10. The hot-runner nozzle system of claim 1 , wherein:

the sieve is configured to accommodate:

a device; and

a wire being routed to the device, the wire being connected with the device.

11. The hot-runner nozzle system of claim 1 , wherein:

the sieve is configured to accommodate:

a valve stem being movable relative to the sieve.

12. The hot-runner nozzle system of claim 1 , wherein:

the nozzle housing, has:

an entrance being connectable with a melt passageway associated with a manifold of a hot runner, and

an exit;

the sieve is securely coupling with the exit of the nozzle housing, the sieve includes:

the retainer securely extending from the sieve;

the nozzle tip is securely coupled relative to the sieve, the nozzle tip securely connects with the retainer,

a thermal-expansion coefficient being associated with the retainer is lower than:

(i) a thermal-expansion coefficient being associated with the sieve, and

(ii) a thermal-expansion coefficient being associated with the nozzle tip,

so that when the retainer, the sieve and the nozzle tip are heated, the nozzle tip is prevented from becoming disconnected relative to the sieve.

13. The hot-runner nozzle system of claim 1 , wherein:

the retainer is configured to:

accommodate a device, and

route a wire to the device, the wire being connectable to the device.

14. The hot-runner nozzle system of claim 1 , wherein:

the sieve, includes:

a center portion , having:

an aft face; and

the retainer is mated with the aft face associated with the center portion of the sieve.

15. The hot-runner nozzle system of claim 1 , wherein:

a thermal-expansion coefficient associated with the retainer is lower than:

a thermal-expansion coefficient associated with the sieve, and

a thermal-expansion coefficient associated with the nozzle tip.

16. The hot-runner nozzle system of claim 1 , wherein:

arrangement of the nozzle housing, the sieve, the nozzle tip and the retainer are such that crack susceptible high stress concentration features that are made with copper alloy are removed from a melt stream.

17. The hot-runner nozzle system of claim 1 , wherein:

arrangement of the nozzle housing, the sieve, the nozzle tip and the retainer allows exertion of hoop stress and fatigue stress only on the nozzle housing and the sieve.

18. The hot-runner nozzle system of claim 1 , wherein:

the nozzle housing, the sieve, the nozzle tip and the retainer collectively define a channel, the channel is routed such that routing and attachment of a thermocouple may be accommodated proximate to the nozzle tip.

19. The hot-runner nozzle system of claim 1 , wherein:

the sieve includes:

a center portion located along a longitudinal axis of the sieve, the center portion includes:

an opening being configured to accommodate a device.

20. The hot-runner nozzle system of claim 1 , wherein:

the sieve includes:

a center portion having a passageway,

a forward face configured to seat the nozzle tip, and

an aft face configured to seat the retainer.

21. The hot-runner nozzle system of claim 1 , wherein:

the sieve is configured to accommodate a wire, so that the wire may be coupled with a thermocouple located proximate with the nozzle tip.

22. The hot-runner nozzle system of claim 1 , wherein:

a thermal-expansion coefficient associated with the retainer is less than a thermal-expansion coefficient associated with the sieve so that the nozzle tip and the retainer may be preloaded, and when heated a segment between a forward face and an aft face of the sieve will expand along a longitudinal axis of the nozzle housing more than the retainer will expand.

23. A hot runner having the hot-runner nozzle system of claim 1 .

24. An injection-molding system including a hot runner, the hot runner having the hot-runner nozzle system of claim 1 .

Assignments (3)
RELEASE OF SECURITY AGREEMENT Recorded Jul 19, 2011
From: ROYAL BANK OF CANADA
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 026647/0595 →
SECURITY AGREEMENT Recorded Jan 30, 2008
From: HUSKY INJECTION MOLDING SYSTEMS LTD.
To: ROYAL BANK OF CANADA
Reel/Frame 020431/0495 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2007
From: MOHAMMED, SOHAIL, MR.
To: HUSKY INJECTION MOLDING SYSTEMS LTD.
Reel/Frame 020007/0316 →