IP Library Granted Patent US 7,669,952
Granted Patent B2
US 7,669,952 · App. 11/923,651 · Granted Mar 2, 2010

Printhead integrated circuit assembly with compensation controller

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Quick Facts
Patent No.
US 7,669,952
App. No.
11/923,651
Granted
Mar 2, 2010
Kind
B2
Abstract

This invention relates to a printhead integrated circuit assembly having a substrate, drive circuitry and a controller. The substrate includes a plurality of micro-electromechanical nozzle arrangements formed thereon. The drive circuitry is positioned on the substrate for operatively actuating the respective nozzle arrangements to eject a drop of printing fluid therefrom. The controller is configured to monitor the power required to eject a drop from each nozzle, and to deactivate such nozzle and compensate with another nozzle if a required power level is exceeded.

Claims (10)

1. A printhead integrated circuit assembly comprising:

a substrate having a plurality of micro-electromechanical nozzle arrangements formed thereon;

drive circuitry positioned on the substrate for operatively actuating the respective nozzle arrangements to eject a drop of printing fluid therefrom; and

a controller configured to monitor the power required to eject a drop from each nozzle, and to deactivate such nozzle and compensate with another nozzle if a required power level is exceeded, wherein

the drive circuitry actuates a nozzle arrangement by causing a current to flow to an actuator beam thereof to produce thermal expansion of said beam.

2. The printhead integrated circuit assembly of claim 1 , wherein the controller monitors the power required by monitoring the energy required to actuate the actuator beam.

3. The printhead integrated circuit assembly of claim 1 , wherein the actuator beam is connected to the drive circuitry in the form of a CMOS layer by means of conductive pads.

4. The printhead integrated circuit assembly of claim 1 , wherein the nozzle arrangements are hexagonally shaped to allow for close packing of the nozzles on the substrate.

5. The printhead integrated circuit assembly of claim 1 , wherein the nozzle arrangements are arranged in staggered rows on the substrate to allow for close packing of such nozzles.

6. The printhead integrated circuit assembly of claim 1 , wherein each nozzle arrangement includes a containment formation to isolate leaked or misdirected ink from adjacent nozzle arrangements to prevent interference between nozzle arrangements.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028581/0721 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 25, 2007
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 020011/0004 →