IP Library Granted Patent US 7,944,782
Granted Patent B2
US 7,944,782 · App. 11/923,976 · Granted May 17, 2011

90°-bent metallic waveguide having tapered c-shaped aperture, method of fabricating the waveguide, light delivery module including the waveguide, and heat assisted magnetic recording head having the waveguide

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Quick Facts
Patent No.
US 7,944,782
App. No.
11/923,976
Granted
May 17, 2011
Kind
B2
Abstract

A metallic wave guide and a light delivery module are provided. The metallic waveguide includes a metal body formed of a conductive metal and having an aperture formed therethrough, the aperture having input and output ends. The aperture has a bent portion for changing a light traveling direction between the input and output ends, and a tapered portion between the bent portion and the output end. The tapered portion has a width that is gradually reduced toward the output end, and the aperture is formed in a C-shape by a ridge formed on an inner surface of the metal body.

Claims (59)

1. A metallic waveguide comprising a metal body that is formed of conductive metal, and comprises an aperture whose input end and output end are formed through the metal body, wherein the aperture comprises:

a bent portion that changes a light traveling direction between the input and output ends; and

a tapered portion between the bent portion and the output end,

wherein the tapered portion has a width that is gradually reduced toward the output end, and the aperture is formed in a C-shape by a ridge formed on an inner surface of the metal body.

2. The metallic waveguide of claim 1 , wherein, when a thickness of the metallic waveguide is defined in a direction where the light travels, a thickness t out of the metallic waveguide from the bent portion of the aperture to the tapered portion of the aperture is greater than a thickness t in of the metallic waveguide from the input end to a before-bent portion.

3. The metallic waveguide of claim 2 , wherein the thickness t in is determined such that a frequency of an incident beam coincides with a thickness resonance frequency through a thickness resonance analysis with respect to a portion of the metallic waveguide from the input end to the before-bent portion.

4. The metallic waveguide of claim 3 , wherein the thickness t in satisfies an equation:

t in =0.25λ±Δ t res,α

where λ is a wavelength of the light and Δt res,α is a thickness deviation related to front scattering and resonance.

5. The metallic waveguide of claim 3 , wherein a thickness t tp of the metallic waveguide at the tapered portion is determined such that the frequency of the incident beam coincides with the thickness resonance frequency through a thickness resonance analysis with respect to the tapered portion of the metallic waveguide.

6. The metallic waveguide of claim 5 , wherein the thickness t tp satisfies an equation:

t tp =0.25λ±Δ t res,γ

where, λ is a wavelength of the light and Δt res,γ is a thickness deviation related to rear scattering and resonance.

7. The metallic waveguide of claim 5 , wherein the thickness t out is determined such that the frequency of the incident beam coincides with the thickness resonance frequency through a thickness resonance analysis with respect to the overall metallic waveguide in a state where the thickness t in and the thickness t tp are fixed.

8. The metallic waveguide of claim 7 , wherein the thickness t out satisfies an equation:

t out =0.5λ±Δ t res,β

where, λ is a wavelength of the light and t res,β is a thickness deviation related to scattering at the bent portion of the aperture and resonance.

9. The metallic waveguide of claim 1 , wherein each of the metal body and the aperture formed through the metal body has a width and a height that is less than the width.

10. The metallic waveguide of claim 1 , wherein the aperture is filled with air or a dielectric.

11. The metallic waveguide of claim 1 , wherein a width and a height of the ridge are uniformly maintained.

12. A method of fabricating the metallic waveguide of claim 1 , the method comprising:

forming a metal layer on a substrate;

forming the ridge in a bent shape by etching a portion of the metallic layer such that the ridge has a predetermined width and thickness;

depositing an ultraviolet (UV)-curable resin on the ridge and the rest of the metal layer;

forming the aperture bent surrounding the ridge and having a tapered structure whose width is gradually reduced at an end by partly hardening the UV-curable resin;

removing an unhardened portion of the UV-curable resin; and

forming another metal layer surrounding the aperture.

13. A light delivery module comprising:

a first metallic waveguide that is formed of a conductive metal body and provided with an aperture therein; and

a second waveguide that delivers light from a light source to the first metallic waveguide,

wherein the aperture comprises:

a bent portion that changes a light traveling direction between an input end and an output end; and

a tapered portion between the bent portion and the output end,

wherein the tapered portion has a width that is gradually reduced toward the output end, and the aperture is formed in a C-shape by a ridge formed on an inner surface of the first metallic waveguide.

14. The light delivery module of claim 13 , wherein, when a thickness of the first metallic waveguide is defined in a direction where the light travels, a thickness t out of the first metallic waveguide from the bent portion of the aperture to the tapered portion of the aperture is greater than a thickness t in of the first metallic waveguide from the input end to a before-bent portion.

15. The light delivery module of claim 14 , wherein the thickness t in is determined such that a frequency of an incident beam coincides with a thickness resonance frequency through a thickness resonance analysis with respect to a portion of the first metallic waveguide from the input end to the before-bent portion.

16. The light delivery module of claim 15 , wherein a thickness t tp of the first metallic waveguide at the tapered portion is determined such that the frequency of the incident beam coincides with the thickness resonance frequency through a thickness resonance analysis with respect to the tapered portion of the first metallic waveguide.

17. The light delivery module of claim 16 , wherein the thickness t out is determined such that the frequency of the incident beam coincides with the thickness resonance frequency through a thickness resonance analysis with respect to the overall first metallic waveguide in a state where the thickness t in and the thickness t tp are fixed.

18. The light delivery module of claim 13 , wherein the second waveguide is formed in a flat shape where a width is greater than a height, and a width of an input end is greater than a width of an output end.

19. The light delivery module of claim 18 , wherein each of the first metallic waveguide and the aperture has a width and a height that is less than the width to realize a profile matching with the second waveguide;

20. A heat assisted magnetic recording head comprising:

a magnetic recording unit which forms a magnetic field that records information on a magnetic recording medium;

a light delivery module which emits light to heat a recording region of the magnetic recording medium,

wherein the light delivery module comprises:

a first metallic waveguide that is formed of a conductive metal body and provided with an aperture therein; and

a second waveguide that delivers light from a light source to the first metallic waveguide,

wherein, the aperture comprises:

a bent portion that changes a light traveling direction between an input end and an output end; and

a tapered portion between the bent portion and the output end, and

wherein the tapered portion has a width that is gradually reduced toward the output end, and the aperture is formed in a C-shape by a ridge formed on an inner surface of first metallic waveguide.

21. The heat assisted magnetic recording head of claim 20 , wherein, when a thickness of the first metallic waveguide is defined in a direction where the light travels, a thickness t out of the first metallic waveguide from the bent portion of the aperture to the tapered portion of the aperture is greater than a thickness t in of the first metallic waveguide from the input end to a before-bent portion.

22. The heat assisted magnetic recording head of claim 21 , wherein the thickness t in is determined such that a frequency of an incident beam coincides with a thickness resonance frequency through a thickness resonance analysis with respect to a portion of the first metallic waveguide from the input end to the before-bent portion.

23. The heat assisted magnetic recording head of claim 22 , wherein a thickness t tp of the first metallic waveguide at the tapered portion is determined such that the frequency of the incident beam coincides with the thickness resonance frequency through a thickness resonance analysis with respect to the tapered portion of the first metallic waveguide.

24. The heat assisted magnetic recording head of claim 23 , wherein the thickness t out is determined such that the frequency of the incident beam coincides with the thickness resonance frequency through a thickness resonance analysis with respect to the overall first metallic waveguide in a state where the thickness t in and the thickness t tp are fixed.

25. The heat assisted magnetic recording head of claim 20 , wherein the magnetic recording unit comprises:

a main pole forming a magnetic field magnetizing the magnetic recording medium;

a return pole disposed facing a surface of the main pole and magnetically connected to the main pole to form a magnetic path;

an inductive coil for inducing the magnetic field to the main pole;

a sub-yoke disposed on the other surface of the main pole to assist the focusing of magnetic flux on an extreme end of the main pole.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE ERRONEOUSLY FILED NO. 7255478 FROM SCHEDULE PREVIOUSLY RECORDED AT REEL: 028153 FRAME: 0689. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Oct 5, 2016
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 040001/0920 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SEAGATE TECHNOLOGY INTERNATIONAL
Reel/Frame 028153/0689 →