Method of forming an integrated optical polarization grid on an LCD substrate and liquid crystal display manufactured to include the grid
View Patent ↗A method of forming a wire grid polarizing pattern across the relatively large surface area of a display substrate includes using a nano imprint lithograph process wherein wire grid polarizing patterns are formed by bonding a stamp having a stamping area substantially smaller than that of the substrate with successive reticle areas of the substrate, where the substrate has a photosensitive film deposited thereon and where the stamping is such that recesses having a predetermined depth are formed in the photosensitive film, and then filling the recesses with an insulating film and etching it using the insulating film as a mask. Since mechanical misalignment margin is acceptable from one reticle area to the next, a wire grid polarizing pattern with a uniform line width and spacings in each reticle area can be formed on a substrate having a large area.
1. A method of forming a polarizer, the method comprising:
providing a substrate having a reflective layer formed over the substrate and a photo-hardenable film formed over the reflective layer;
forming recesses having a predetermined widths and depths at predetermined regions in the photo-hardenable film;
hardening the photo-hardenable film;
filling the hardened recesses with an insulating material; and
etching the photo-hardened film and the reflective layer by using the insulating material as an etch mask.
2. The method of claim 1 , wherein the reflective layer is formed of a reflective substance including aluminum.
3. The method of claim 1 , further comprising:
forming an anti-reflective film between the reflective layer and the photo-hardenable film.
4. The method of claim 1 , wherein the recesses are formed by bonding a stamp having a predetermined engraved pattern with the photo-hardenable film prior to hardening the photo-hardenable film.
5. The method of claim 1 , wherein the recesses are formed to have a depth in the range of 10 to 50% in respect to the thickness of the photo-hardenable film.
6. The method of claim 1 , wherein the insulating material filled in the recesses is formed by forming an insulating film on the entire upper surface to fill the recesses and applying a blanket etch back over the entire insulating film to thereby expose portions of the photo-hardened film that were not recessed.
7. The method of claim 1 , wherein the photo-hardened film is removed by oxygen plasma.
8. The method of claim 1 , the reflective layer is etched by mixed plasma of BCl 3 , Cl 2 , SF 6 , and O 2 .