Electrode with increased stability and method of manufacturing the same
The present invention provides an implantable electrode with increased stability wherein the surface is of the electrode comprises mesh grids which are filled with sticks which are filed with a conducting or insulating material. The present invention further provides a method of manufacturing an electrode with increased stability, comprising: depositing a metal layer on an base layer; applying photoresist layer on the metal layer; patterning the photoresist layer providing openings; electroplating the openings with metal; removing the photoresist layer leaving spaces; and filling the spaces with polymer.
1. A method of manufacturing an electrode with increased stability, comprising:
a) providing a polymer base layer;
b) depositing a metal layer on the polymer base layer, the metal layer forming a single electrode base;
c) applying polymer top layer covering the edges of the single electrode base;
d) applying photoresist layer on the single electrode base;
e) patterning the photoresist layer providing a plurality of openings through the photoresist layer to the single electrode base;
f) electroplating the openings with metal forming a plurality of protrusions on the single electrode base;
g) removing the photoresist layer leaving a plurality of spaces between the plurality of protrusions on the single electrode base; and
h) filling the plurality of spaces with a polymer cover layer, wherein the plurality of protrusions extend beyond the polymer cover layer;
wherein the plurality of protrusions separated by the polymer cover layer are electrically connected with the single electrode base extending under the polymer cover layer and forming part of the single electrode having an increase in electrode polymer cover layer edge length of the single electrode as compared with an electrode of the same size without the polymer cover layer in the spaces.
2. The method according to claim 1 , wherein the metal comprises Pt, Ir, Au, Ru, Pd, IrO or alloys thereof and the polymer base layer comprises polyimide, silicone, peek or parylene, or mixtures thereof.
3. A method of manufacturing an electrode with increased stability, comprising:
a) providing a polymer base layer;
b) depositing a metal layer on the polymer base layer, the metal layer forming a single electrode base;
c) applying a polymer top layer on the metal layer, covering at least the edges of the single electrode base;
d) applying photoresist layer on the polymer layer;
e) patterning the photoresist layer providing a plurality of openings through the polymer layer to the single electrode base;
f) electroplating the openings with metal, forming a plurality of protrusions on the single electrode base extending beyond the polymer top layer; and
g) removing the photoresist layer
wherein the plurality of protrusions separated by the polymer top layer are electrically connected and common forming part of the single electrode having an increase in electrode polymer top layer edge length of the single electrode as compared with the electrode without the polymer top layer.
4. The method according to claim 3 , wherein the metal comprises Pt, Ir, Au, Ru,
Pd, IrO or alloys thereof and the polymer base layer comprises polyimide, silicone, peek or parylene, or mixtures thereof.
5. The method according to claim 1 , wherein the increase in electrode polymer cover layer edge length is 100% or greater.
6. The method according to claim 1 , wherein the increase in electrode polymer cover layer edge length is 120% or greater.
7. The method according to claim 3 , wherein the increase in electrode polymer top layer edge length is 100% or greater.
8. The method according to claim 3 , wherein the increase in electrode polymer top layer edge length is 120% or greater.