Semiconductor device
View Patent ↗A semiconductor device is disclosed. One embodiment provides an arrangement of a plurality of semiconductor chips arranged side by side in a spaced apart relationship. A first material fills at least partly the spacings between adjacent semiconductor chips. A second material is arranged over the semiconductor chips and the first material. A coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.
1. An arrangement, comprising:
a plurality of semiconductor chips arranged side by side in a spaced apart relationship;
a first material filling at least partly the spacings between adjacent semiconductor chips; and
a second material arranged over the semiconductor chips and the first material,
wherein a coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the arrangement in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the arrangement in a plane intersecting the second material.
2. The arrangement of claim 1 , comprising wherein the coefficient of thermal expansion of the first material is larger than the coefficient of thermal expansion of the second material.
3. The arrangement of claim 1 , comprising wherein the first material is a foil.
4. The arrangement of claim 1 , comprising wherein the first material is made of a curable liquid.
5. The arrangement of claim 1 , comprising wherein the first material is one of the group consisting of an epoxy resin, a phenol resin or a thermosetting plastic.
6. The arrangement of claim 1 , comprising wherein the first material is filled with a particle-containing filler.
7. The arrangement of claim 6 , wherein the filler comprises at least one of the group of glass particles, metal particles or ceramic particles.
8. The arrangement of claim 1 , wherein the first material at least partially covers the semiconductor chips.
9. The arrangement of claim 1 , comprising wherein the first material separates the plurality of semiconductor chips from the second material.
10. The arrangement of claim 1 , comprising wherein a lateral dimension of the arrangement is larger than 20 cm, in particular 30 cm.
11. An arrangement of semiconductor chips, comprising:
a plurality of semiconductor chips arranged side by side in a spaced apart relationship;
a first material filling at least partly the spacings between adjacent semiconductor chips; and
a second material arranged over the semiconductor chips and the first material,
wherein the coefficient of thermal expansion of the first material is in the range of 50 to 100·10-6/K and the coefficient of thermal expansion of the second material is in the range of 6 to 20·10-6/K.
12. The arrangement of claim 11 , comprising wherein the first material is a foil.
13. The arrangement of claim 11 , comprising wherein the first material is made of a curable liquid.
14. The arrangement of claim 11 , comprising wherein the first material separates the plurality of semiconductor chips from the second material.
15. The arrangement of claim 11 , comprising wherein a lateral dimension of the arrangement is larger than 20 cm.
16. A module, comprising:
a semiconductor chip;
a first material laterally surrounding the semiconductor chip; and
a second material arranged over the semiconductor chip and the first material,
wherein a coefficient of thermal expansion of the first material is selected to adapt the lateral thermal expansion of the module in a plane intersecting the first material and the semiconductor chips to the lateral thermal expansion of the module in a plane intersecting the second material.
17. The module of claim 16 , comprising wherein the first material is a foil.
18. The module of claim 16 , comprising wherein the first material is made of a curable liquid.