Small form factor transmitter optical subassembly (TOSA) having functionality for controlling the temperature, and methods of making and using the TOSA
View Patent ↗The invention is directed to an OSA having a TO-can-type configuration that is relatively low-cost to manufacture and that has functionality for monitoring and controlling the temperature of the laser diode without the need for additional pins or an increase in the size of the OSA. Thus, the OSA typically includes four or five pins at most. These features of the invention are achieved by providing a thermal control circuit, a temperature sensor and a heater that are integrated along with a laser output power monitor photodiode into the submount assembly substrate.
1. A transmitter optical subassembly (TOSA) comprising:
a submount assembly substrate, the substrate comprising one or more surfaces, and a plurality of conductors disposed on or in said substrate;
a plurality of electrically conductive pins, each pin being electrically coupled to one of said plurality of conductors;
a thermal controller integrated in said substrate;
a temperature sensor integrated in said substrate;
a heater integrated into said substrate, at least one of said plurality of conductors being electrically coupled to said thermal controller and to said temperature sensor, at least one of said plurality of conductors being electrically coupled to said thermal controller and to said heater, at least one of said plurality of conductors being electrically coupled to one of said pins and to said thermal controller;
a laser diode die mounted on the substrate, the laser diode die having one or more conductors that are electrically coupled to one or more of said plurality of conductors of said substrate, the heater being in close proximity to the laser diode to allow the heater to heat the laser diode based on determinations made by the thermal controller; and
a monitor photodiode mounted on or integrated in the substrate, the monitor photodiode having one or more conductors that are electrically coupled to one or more of said plurality of conductors of said substrate, wherein the sub mount assembly includes five or less electrically conductive pins, each pin being electrically coupled to a respective one of said plurality of conductors, wherein said five or less electrically conductive pins of the submount assembly includes at least first, second, third, fourth, and fifth electrically conductive pins, wherein the first electrically conductive pin provides a modulation current to the laser diode die, wherein the second electrically conductive pin provides a positive supply voltage, Vdd, to one or more components integrated in or mounted on the substrate including the thermal controller, wherein the third electrically conductive pin provides ground potential to one or more components integrated in or mounted on the substrate including the laser diode die, wherein the fourth electrically conductive pin receives a monitoring current from the monitor photodiode, and wherein the fifth electrically conductive pin provides a negative supply voltage, Vss, to one or more components integrated in or mounted on the substrate including the thermal controller.
2. The TOSA of claim 1 , wherein the monitor photodiode is integrated in the substrate.
3. The TOSA of claim 1 , further comprising an electrostatic discharge (ESD) diode mounted on or integrated in the substrate, the ESD diode having one or more conductors that are connected to one or more of said plurality of conductors of the substrate such that the ESD diode is electrically connected to in parallel with the laser diode.
4. The TOSA of claim 3 , wherein the ESD diode is integrated in the substrate.
5. The TOSA of claim 4 , wherein the monitor photodiode is integrated in the substrate.
6. A method for controlling the temperature of a laser diode in a transmitter optical submount assembly (TOSA), the method comprising:
providing a submount assembly substrate having at least a thermal controller, a temperature sensor and a heater integrated therein, the substrate having a laser diode die attached and wire bonded to a surface of the substrate, the heater being in close proximity to the laser diode die;
using the temperature sensor and thermal controller to monitor a temperature of the laser diode die;
using the thermal controller to control the heater to cause the heater to heat the laser diode die if the thermal controller determines that the temperature of the laser diode die is too low, wherein the TOSA has, at most, five electrically conductive pins for inputting signals to or outputting signals from the TOSA; and
electrically coupling each pin to a respective one of said plurality of conductors, wherein said five electrically conductive pins of the submount assembly includes at least first, second, third, fourth, and fifth electrically conductive pins, wherein the first electrically conductive pin provides a modulation current to the laser diode die, wherein the second electrically conductive pin provides a positive supply voltage, Vdd, to one or more components integrated in or mounted on the substrate including the thermal controller, wherein the third electrically conductive pin provides ground potential to one or more components integrated in or mounted on the substrate including the laser diode die, wherein the fourth electrically conductive pin receives a monitoring current from the monitor photodiode, and wherein the fifth electrically conductive pin provides a negative supply voltage, Vss, to one or more components integrated in or mounted on the substrate including the thermal controller.
7. The method of claim 6 , wherein the submount assembly substrate provided also has a monitor photodiode integrated therein.
8. The method of claim 1 , wherein the submount assembly substrate provided also has a monitor photodiode mounted on and electrically connected to one or more conductors formed on or it the substrate.
9. A method for controlling the temperature of a laser diode in a transmitter optical submount assembly (TOSA), the method comprising:
providing a submount assembly substrate having at least a thermal controller, a temperature sensor and a heater integrated therein, the substrate having a laser diode die attached and wire bonded to a surface of the substrate, the heater being in close proximity to the laser diode die;
using the temperature sensor and thermal controller to monitor a temperature of the laser diode die;
using the thermal controller to control the heater to cause the heater to heat the laser diode die if the thermal controller determines that the temperature of the laser diode die is too low, wherein the TOSA has, at most, five electrically conductive pins for inputting signals to or outputting signals from the TOSA; and
electrically coupling each pin to a respective one of said plurality of conductors, wherein said five electrically conductive pins of the submount assembly includes at least first, second, third, fourth, and fifth electrically conductive pins, wherein the first electrically conductive pin provides a modulation current to the laser diode die, wherein the second electrically conductive pin provides a positive supply voltage, Vdd, to one or more components integrated in or mounted on the substrate including the thermal controller, wherein the third electrically conductive pin provides ground potential to one or more components integrated in or mounted on the substrate including the laser diode die, wherein the fourth electrically conductive pin receives a monitoring current from the monitor photodiode, and wherein the fifth electrically conductive pin provides a negative supply voltage, Vss, to one or more components integrated in or mounted on the substrate including the thermal controller.
10. The method of claim 9 , further comprising providing the submount assembly with a monitor photodiode.