Shielded capacitor structure
View Patent ↗A method and apparatus if provided for shielding a capacitor structure formed in a semiconductor device. In a capacitor formed in an integrated circuit, one or more shields are disposed around layers of conductive strips to shield the capacitor. The shields confine the electric fields between the limits of the shields.
1. A method of shielding a capacitor structure formed on a semiconductor substrate that provides a capacitance between a first and second node comprising:
providing a capacitor structure having one or more layers of conductive strips, wherein some of the conductive strips are electrically coupled to the first node and some of the conductive strips are electrically coupled to the second node;
forming a first conductive shield on a first layer disposed adjacent to the provided capacitor structure;
electrically coupling the first conductive shield to the first node;
forming a second conductive shield on a second layer disposed adjacent to the provided capacitor structure; and
electrically coupling the second conductive shield to the second node.
2. The method of claim 1 , wherein the first conductive shield is disposed above the layers of conductive strips.
3. The method of claim 2 , wherein the second conductive shield is disposed below the layers of conductive strips.
4. The method of claim 1 , wherein the first conductive shield is formed by a plurality of conductive strips electrically coupled together.
5. The method of claim 4 , wherein the plurality of conductive strips forming the first conductive shield are electrically coupled to the first node.
6. The method of claim 1 , further comprising a third conductive shield disposed adjacent to the provided capacitor structure.
7. The method of claim 6 , wherein the third conductive shield is electrically coupled to one of the first and second nodes.
8. The method of claim 6 , wherein the third conductive shield is formed using a plurality of conductive strips formed on two or more conductive layers.
9. A method of shielding a capacitor formed using multi-layer device for providing a capacitance between first and second nodes comprising:
on a first layer of the multi-layer device, forming a plurality of conductive strips;
electrically coupling some of the conductive strips formed on the first layer to a first node;
electrically coupling some of the conductive strips formed on the first layer to a second node;
on a second layer of the multi-layer device, forming a plurality of conductive strips;
electrically coupling some of the conductive strips formed on the second layer to the first node;
electrically coupling some of the conductive strips formed on the second layer to the second node;
on a third layer of the multi-layer device, forming a first shield electrically coupled to the first node; and
on a fourth layer of the multi-layer device, forming a second shield electrically coupled to the second node.
10. The method of claim 9 , wherein the conductive strips formed on the first and second layers are alternately electrically coupled to the first and second nodes.
11. The method of claim 9 , wherein the conductive strips on the first and second layers are aligned such that strips on the second layer that are electrically coupled to the first node lie above strips on the first layer that are electrically coupled to the first node.