Low Peak Exotherm Curable Compositions
Compositions having a curable unsaturated compound, an adhesion promoter and curing agent which have a peak exotherm of less than 50° C. are disclosed. The compositions when cured are flexible bioadhesives which are also disclosed. Non-curable diluents can be included in the compositions. Flexible bioadhesives formed on biological structures and having low peak exotherms upon curing of curable compositions to form the flexible bioadhesives are disclosed. Compositions having a curable unsaturated compound and a curing agent and a peak exotherm of less than 50° C. are included in the invention.
1 - 55 . (canceled)
56 . A curable composition comprising polymerization catalysts, wherein a polymerization reaction is initiated by application of an outside energy source, through the combination (at the time of use) of two or more composition components, or combinations thereof.
57 . The curable composition of claim 56 wherein a light-activated polymerization catalyst comprises at least one photoinitiator capable of initiating a polymerization reaction upon exposure to light.
58 . The curable composition of claim 57 wherein light comprises wavelengths in the visible, near infrared, ultraviolet spectrum or combinations thereof.
59 . The curable composition of claim 57 wherein said photoinitiator includes camphorquinone, benzoin methyl ether, benzoin ethyl ether, benzoin butyl ether, 2-hydroxy-2-methyl-1-phenyl propane-1-one, oligo[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone], benzildimethylketal, 2-isopropylthioxanthone, 4-isopropylthixanthone, benzophenone (and derivatives), 9,10-anthraquinone, 1-hydroxycyclohexyl phenyl ketone, and the like, and combinations (where compatible) thereof.
60 . A method of making a composition comprising the steps of:
selecting a compound having an unsaturation index of at least 500; and
mixing said compound with a curing agent, a therapeutic ingredient, and an adhesion promoter, wherein the mixture is curable and has a peak exotherm of less than about 50.degree. C. (120.degree F.).