IP Library Granted Patent US 7,855,828
Granted Patent B2
US 7,855,828 · App. 11/932,043 · Granted Dec 21, 2010

Electrophoretic display device and method of manufacturing the same

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Quick Facts
Patent No.
US 7,855,828
App. No.
11/932,043
Granted
Dec 21, 2010
Kind
B2
Abstract

An electrophoretic display device and a manufacturing method thereof are provided. The manufacturing method includes forming a first mother substrate that has a first thin structure, and forming a second mother substrate that has a second thin structure. The second mother substrate faces the first mother substrate. The manufacturing method also includes disposing an electrophoretic material on one of the first mother substrate and the second mother substrate, and enclosing a region on which the electrophoretic material is disposed with a sealant. The manufacturing method further includes combining the first mother substrate and the second mother substrate using pressure applied thereto to form an electrophoretic layer between the first mother substrate and the second mother substrate.

Claims (30)

1. A manufacturing method of an electrophoretic display device, the manufacturing method comprising:

forming a first mother substrate that has a first thin structure;

forming a second mother substrate that has a second thin structure, wherein the second mother substrate faces the first mother substrate;

disposing an electrophoretic material on one of the first mother substrate and the second mother substrate;

enclosing a region on which the electrophoretic material is disposed with a sealant; and

combining the first mother substrate and the second mother substrate using pressure applied thereto, while forming an electrophoretic layer between the first mother substrate and the second mother substrate,

wherein the formation of the first mother substrate comprises:

forming a gate electrode on a substrate;

forming a semiconductor on the gate electrode;

forming a source electrode and a drain electrode on the semiconductor; and

forming a pixel electrode on the source electrode and the drain electrode, the pixel electrode being connected to the drain electrode.

2. The manufacturing method of claim 1 , further comprising cutting the combined first mother substrate and second mother substrate.

3. The manufacturing method of claim 1 , wherein the second thin film structure comprises a common electrode.

4. The manufacturing method of claim 3 , wherein the formation of the second mother substrate comprises:

forming a light blocking member on a substrate;

forming color filters on the light blocking member; and

forming the common electrode on the color filters.

5. The manufacturing method of claim 3 , wherein the electrophoretic material is disposed in a matrix pattern.

6. The manufacturing method of 1 , wherein the electrophoretic material comprises:

a first electrophoretic particle representing a first color;

a second electrophoretic particle representing a second color different from the first color;

a dispersion medium in which the first electrophoretic particle and the second electrophoretic particle are dispersed;

a capsule that encapsulates the first electrophoretic particle and the second electrophoretic particle; and

a binder fixing the capsule.

7. The manufacturing method of claim 6 , wherein the first color is white, and the second color is black.

8. The manufacturing method of claim 1 , wherein the electrophoretic material has a moisture content of about 40% to about 60%.

9. The manufacturing method of claim 1 , wherein the first mother substrate comprises a plurality of sub-regions, the method further comprising cutting the first mother substrate along lines formed between the sub-regions.

10. The manufacturing method of claim 9 , wherein the thin film transistor is formed on the sub-regions.

11. The manufacturing method of claim 3 , wherein the second mother substrate comprises a plurality of sub-regions, the method further comprising cutting the second mother substrate along lines formed between the sub-regions.

12. The manufacturing method of claim 11 , wherein the common electrode is formed on the sub-regions.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2020
From: SAMSUNG DISPLAY CO., LTD.
To: HYDIS TECHNOLOGIES CO., LTD.
Reel/Frame 052598/0856 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029093/0177 →