IP Library Granted Patent US 7,876,561
Granted Patent B2
US 7,876,561 · App. 11/932,479 · Granted Jan 25, 2011

Cooling systems for variable speed drives and inductors

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Quick Facts
Patent No.
US 7,876,561
App. No.
11/932,479
Granted
Jan 25, 2011
Kind
B2
Abstract

A plastic liquid cooled variable speed drive or inductor provided. The cooler provides lightweight, space conservative, corrosive free cooling to the components as well as provides a mounting area for modules. A cooler can be mounted to the core of an inductor to absorb heat generated by the core losses.

Claims (14)

1. A power assembly for a variable speed drive system comprising:

a film capacitor;

the film capacitor is mounted on an outside surface of at least one cooling device, the at least one cooling device operating as a heat sink for the film capacitor and being configured to circulate a cooling fluid through the at least one cooling device;

at least one electrical component mounted on the at least one cooling device, the at least one electrical component being directly cooled by the circulating cooling fluid in the at least one cooling device; and

wherein the at least one cooling device comprises a plastic material.

2. The power assembly of claim 1 wherein the film capacitor comprises mounting fasteners to mount additional components and to mount the power assembly in an enclosure.

3. The power assembly of claim 1 wherein the plastic material is selected from the group consisting of polyphenylene oxide, modified, polybutylene terephthalate, and polymide.

4. The power assembly of claim 1 wherein the at least one cooling device operates at a continuous use temperature of approximately 100 degrees centigrade.

5. The power assembly of claim 1 wherein the fluid directed through the at least one cooling device is refrigerant, glycol or water.

6. The power assembly of claim 1 wherein the at least one cooling device is manufactured by an injection molding process or a machined process.

7. The power assembly of claim 1 wherein the plastic material exhibits a low temperature coefficient of thermal expansion.

8. The power assembly of claim 1 wherein a plurality of electronic components are mounted to the at least one cooling device.

9. The power assembly of claim 1 wherein the at least one cooling device mounted on the film capacitor is secured to the film capacitor with at least one fastener.

10. The power assembly of claim 9 wherein the at least one fastener is a screw.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2025
From: JOHNSON CONTROLS TYCO IP HOLDINGS LLP
To: TYCO FIRE & SECURITY GMBH
Reel/Frame 072275/0395 →
NUNC PRO TUNC ASSIGNMENT Recorded Feb 4, 2022
From: JOHNSON CONTROLS TECHNOLOGY COMPANY
To: JOHNSON CONTROLS TYCO IP HOLDINGS LLP
Reel/Frame 058959/0764 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2008
From: SCHNETZKA, HAROLD R.; JADRIC, IVAN; HOOVER, STEVE; ROGERS, KATHLEEN S.; YANIK, MUSTAFA KEMAL
To: JOHNSON CONTROLS TECHNOLOGY COMPANY
Reel/Frame 020448/0531 →