Method for joining implants
View Patent ↗The present invention provides a method of securing a suture. The method includes providing a retainer having first and second sections. The first section has a central post, and the second section has a central bore dimensioned to receive the central post. The method also includes moving a suture through a passage in the first section, wrapping the suture around the central post, and moving the suture through a channel of the second section. The method further includes interconnecting the first and second sections with the central post positioned in the central bore and with the suture disposed between the first and second sections. Moreover, the method includes bonding the first and second sections together to secure the suture relative to the retainer.
1. A method for joining a first implant and a second implant, the method comprising:
positioning the first implant into a body of a patient, the first implant having an upper surface with at least one recess or a plurality of pores and a surface feature configured to contact a portion of a lower surface of the second implant;
positioning the second implant into the body of the patient, the second implant having a lower surface with a projection and wherein at least the projection of the second implant is configured to contact at least a portion of the upper surface of the first implant;
applying ultrasonic energy to the second implant to soften at least a portion of the projection or the surface feature at or near a joining region; and
applying a force to the second implant such that at least a portion of the first or second implant deforms to join the first and second implants at or near the joining region.
2. The method of claim 1 wherein the projection or the surface feature includes an energy director configured to concentrate the ultrasonic energy.
3. The method of claim 1 wherein the at least a portion of the projection or the surface feature is heated into or above its transition temperature range.
4. The method of claim 1 wherein the application of the force is initiated during the application of the ultrasonic energy.
5. The method of claim 1 wherein the application of the force is continued after the application of the ultrasonic energy.
6. The method of claim 1 wherein at least a portion of the projection or the surface feature flows after application of the force is initiated.
7. The method of claim 1 wherein the first implant includes a groove or a second recess.
8. A method for joining a first implant and a second implant, the method comprising:
providing a first implant having an upper surface with a recess or plurality of pores and a surface feature configured to contact a portion of a lower surface of the second implant;
providing a second implant having a lower surface with a projection, wherein at least a portion of the second implant is configured to contact at least a portion of the recess or plurality of pores of the upper surface of the first implant;
applying ultrasonic energy to the second implant to soften at least a portion of the projection or the surface feature; and
applying a force to the second implant such that at least a portion of the projection or the surface feature deforms to join the first and second implants.
9. The method of claim 8 wherein the projection or the surface feature includes an energy director configured to concentrate the ultrasonic energy.
10. The method of claim 8 wherein the application of the force is initiated during the application of the ultrasonic energy.
11. The method of claim 8 wherein the application of the force is continued after the application of the ultrasonic energy.
12. The method of claim 8 wherein at least a portion of the projection or the surface feature flows after application of the force is initiated.
13. The method of claim 8 wherein the first implant includes a groove or a second recess.
14. The method of claim 8 wherein at least a portion of the projection or the surface feature is heated into or above its transition temperature range.
15. A method for joining a first implant and a second implant, the method comprising:
passing the first implant into a body of a patient, the first implant having an upper surface with at least one recess or a plurality of pores and a surface feature configured to contact a portion of a lower surface of the second implant;
passing the second implant into the body of the patient, the second implant having a lower surface with a projection, and wherein the projection of the second implant is configured to contact at least a portion of the recess or plurality of pores of the first implant;
applying ultrasonic energy to the second implant to thereby soften at least a portion of the projection or the surface feature at or near a joining region; and
applying a force to the second implant such that the projection or the surface feature deforms to join the first and second implants at or near the joining region.
16. The method of claim 15 wherein the projection or the surface feature includes an energy director configured to concentrate the ultrasonic energy.
17. The method of claim 15 wherein the application of the force is initiated during the application of the ultrasonic energy.
18. The method of claim 15 wherein the application of the force is continued after the application of the ultrasonic energy.
19. The method of claim 15 wherein the material of the projection or the surface feature flows after application of the force is initiated.
20. The method of claim 15 wherein the first implant includes a groove or a second recess.