Method of forming an electrode casing for an alkaline electrochemical cell with reduced gassing
View Patent ↗Electrochemical cells including a casing or cup for direct electrical contact with a negative electrode or counter electrode and serving as the current collector for the electrode. The casing includes a substrate having a plated coating of an alloy including copper, tin and zinc, the coating having a composition gradient between the substrate and the external surface of the coating wherein the copper content is greater adjacent the substrate than at the external surface of the coating and the tin content is greater at the external surface of the coating than adjacent the substrate. Methods for forming a coated casing and an electrochemical cell including a coated casing are disclosed, preferably including providing an electrode casing with a coating utilizing variable current density plating that reduces discoloration of a surface exposed to the ambient atmosphere.
1. A method for forming a coated casing for an electrochemical cell, comprising the steps of:
providing an electrode casing comprising a metal substrate having an interior surface and an exterior surface and comprising a copper layer on the interior surface of the substrate;
plating a first metal layer with a plating solution on at least the exterior surface of the substrate that is adapted to be exposed to the atmosphere when assembled in an electrochemical cell utilizing a first current density; and
changing the first current density to a second different current density while the electrode casing is in contact with the plating solution and plating a second metal layer on the first plated layer; wherein:
the first current density of the plating ranges from 10 to 1,076 amps per square meter, and wherein the second current density of the plating ranges from 1.0 to 27.0 amps per square meter with the proviso that the second current density is lower than the first current density; and
the second plated layer has a higher weight percentage of tin and a lower weight percentage of copper compared to the first plated layer, and wherein the first and second plated layers each, independently, comprise copper, tin and zinc.
2. The method according to claim 1 , wherein after plating the first plated layer and the second plated layer, a passivating step is performed on the plated electrode casing utilizing salt passivation or an acid-base passivation.
3. The method according to claim 1 , wherein the plating is performed electrolytically utilizing a rack plating device, a barrel plating device, a spouted bed electroplating device or a vibratory plating device.
4. The method according to claim 1 , wherein from the exterior surface to the interior surface the substrate has a nickel layer, a stainless steel layer, and a copper layer.
5. The method according to claim 1 , wherein the first current density of the plating is at least 26.9 amps per square meter and at most 107.6 amps per square meter, and wherein the second current density of the plating is at least 4.3 amps per square meter and at most 16.2 amps per square meter with the proviso that the second current density is lower than the first current density.
6. The method according to claim 1 , wherein the interior surface and the exterior surface of the electrode casing are plated with the first plated layer and the second plated layer.
7. The method according to claim 6 , wherein the first plated layer has a ratio of copper from 50 to 70 weight percent, tin from 26 to 42 weight percent, and zinc from 3 to 9 weight percent measured at a central portion of the exterior surface of the electrode casing, and wherein the second plated layer has a ratio of copper from 36 to 46 weight percent, tin from 42 to 57 weight percent and zinc from 6.5 to 9.5 weight percent, measured at a central portion of the exterior surface of the electrode casing by SEM/EDS.
8. The method according to claim 7 , wherein the plating is formed electrolytically utilizing a spouted bed electroplating device.
9. The method according to claim 1 , wherein the second plated layer has a ratio of surface values measured according to XPS of 73 to 84 atomic percent copper, 11 to 17 atomic percent tin, and 4 to 10 atomic percent zinc.
10. A method for forming an electrochemical cell, comprising the steps of:
providing a first electrode casing comprising a metal substrate having an interior surface and an exterior surface;
plating the first electrode casing utilizing a variable current density while the first electrode casing is in contact with a plating solution thereby producing a casing having a plating, and wherein the tin content increases from a portion of the plating in contact with the substrate when compared to the plating exposed on the surface of the plated casing; and
forming an electrochemical cell comprising a first electrode in contact with the interior surface of the first electrode casing and an aqueous alkaline electrolyte, wherein prior to plating the first electrode casing has a copper layer on the interior surface; wherein:
a first current density of the variable current density plating ranges from 10 to 1,076 amps per square meter, and wherein a second current density of the variable current density plating ranges from 1.0 to 27.0 amps per square meter with the proviso that the second current density is lower than the first current density; and
at least a first layer and a second layer are plated, wherein the second plated layer has a higher weight percentage of tin and a lower weight percentage of copper compared to the first plated layer, and wherein the first and second plated layers each, independently, comprise copper, tin and zinc.
11. The method according to claim 10 , wherein the plating is performed electrolytically utilizing a rack plating device, a barrel plating device, a spouted bed electroplating device or a vibratory plating device.
12. The method according to claim 11 , wherein from the exterior surface to the interior surface the substrate has a nickel layer, a stainless steel layer, and a copper layer.
13. The method according to claim 10 , wherein the first current density of the plating is at least 26.9 amps per square meter and at most 107.6 amps per square meter, and wherein the second current density of the plating is at least 4.3 amps per square meter and at most 16.2 amps per square meter with the proviso that the second current density is lower than the first current density.
14. The method according to claim 13 , wherein the interior surface and the exterior surface of the electrode casing are plated with a first metal layer and a second metal layer.
15. The method according to claim 14 , wherein the first plated layer has a ratio of copper from 50 to 70 weight percent, tin from 26 to 42 weight percent, and zinc from 3 to 9 weight percent measured at a central portion of the exterior surface of the electrode casing, and wherein the second plated layer has a ratio of copper from 36 to 46 weight percent, tin from 42 to 57 weight percent and zinc from 6.5 to 9.5 weight percent measured at a central portion of the exterior surface of the electrode casing.
16. The method according to claim 15 , wherein the plating is formed electrolytically utilizing a spouted bed electroplating device.
17. The method according to claim 10 , wherein the second layer has a ratio of surface values measured according to XPS of 73 to 84 atomic percent copper, 11 to 17 atomic percent tin, and 4 to 10 atomic percent zinc.
18. The method according to claim 10 , wherein the first electrode is a negative electrode comprising zinc and the second electrode is a positive electrode comprising at least one of manganese dioxide, a silver oxide and a catalytic material for reducing oxygen or for generating hydrogen or oxygen, wherein the cell is a button cell, and wherein the first layer has a thickness greater than a thickness of the second layer, and wherein the first electrode is free of added mercury.