Camera module

1. A camera module comprising:

a lens holder defining a receiving portion thereof;

a lens module partially received in the receiving portion of the lens holder, the lens module comprising a lens barrel movably engaged in the lens holder and at least one lens received in the lens barrel;

an image sensor chip package mounted to the lens holder, comprising:

a circuit board defining a top portion formed thereof, a bottom portion opposite to the top portion, and a plurality of board pads arranged on the top portion;

an image sensor chip mounted on the top portion of the circuit board, the image sensor chip comprising a photosensitive area configured for receiving light transmitted through the lens module, and a plurality of chip pads formed surrounding the photosensitive area;

a plurality of wires each electrically connecting one of the plurality of chip pads of the image sensor chip with a corresponding one of the plurality of board pads of the circuit board;

an adhesive means applied surrounding the photosensitive area and covering the plurality of chip pads;

a transparent layer mounted to the image sensor chip via the adhesive means, the transparent layer together with the adhesive means sealing the photosensitive area of the image sensor chip;

wherein the lens holder is adhered to the top portion of the circuit board, the bottom portion of the circuit board defines at least one recess for receiving at least one electronic element therein, the at least one electronic element electrically connected to the circuit board; each of the at least one recess has a step-shaped configuration and comprises a first recess formed on an upper portion thereof and a second recess coaxially formed on a lower portion thereof;

a cover plate received in the second recess for covering the first recess;

a plurality of zero voltage points formed on the periphery of a middle surface between the first recess and the second recess thereof for adjusting the voltage of conductors connected to the plurality of zero voltage points to zero; and

a plurality of external points also formed on the periphery of the cover plate to electrically connect to the corresponding zero voltage points.

2. The camera module as claimed in claim 1 , wherein the diameter of the second recess is greater than that of the first recess to form the middle surface between the first recess and the second recess.

3. The camera module as claimed in claim 1 , wherein the at least one electronic element is adhered to an upper portion of the cover plate, and the plurality of external points formed surrounding the electronic elements.

4. The camera module as claimed in claim 1 , wherein the at least one electronic element is a passive elements or compositive elements.

5. The camera module as claimed in claim 1 , wherein another recess is formed at the top portion of the circuit board, the image sensor chip received in the another recess.

6. The camera module as claimed in claim 1 , wherein the lens holder has an internal thread formed on an inner surface, the lens barrel has an external thread corresponding to and screwing with the internal thread of the lens holder, the external thread is formed on an external surface of the lens barrel.

7. A camera module comprising:

a lens holder defining a receiving portion thereof;

a lens module partially received in the receiving portion of the lens holder, the lens module comprising a lens barrel movably engaged in the lens holder and at least one lens received in the lens barrel;

an image sensor chip package mounted to the lens holder, comprising:

a circuit board defining a top portion formed thereof, a bottom portion opposite to the top portion, and a plurality of board pads arranged on the top portion;

an image sensor chip mounted on the top portion of the circuit board, the image sensor chip comprising a photosensitive area configured for receiving light transmitted through the lens module, and a plurality of chip pads formed surrounding the photosensitive area;

a plurality of wires each electrically connecting one of the plurality of chip pads of the image sensor chip with a corresponding one of the board pads of the circuit board;

an adhesive means applied surrounding the photosensitive area and covering the plurality of chip pads;

a transparent layer mounted to the image sensor chip via the adhesive means, the transparent layer together with the adhesive means sealing the photosensitive area of the image sensor chip;

wherein the lens holder is adhered to the top portion of the circuit board, the bottom portion of the circuit board defines at least one recess for receiving at least one electronic element therein, the at least one electronic element electrically connected to the circuit board; each of the at least one recess has a step-shaped configuration and comprises a first recess formed on an upper portion thereof and a second recess coaxially formed on a lower portion thereof; the diameter of the second recess is greater than that of the first recess to form a middle surface between the first recess and the second recess;

a cover plate made from electrical conductive material and received in the second recess for covering the first recess; and

a plurality of zero voltage points is formed on the periphery of the middle surface thereof for adjusting the voltage of conductors connected to the plurality of zero voltage points to zero, and a plurality of external points is also formed on the periphery of the cover plate to electrically connect to the corresponding zero voltage points.