Thermal management system and method for electronic assemblies
View Patent ↗According to an embodiment of the present invention, a thermal management system for an electronic assembly includes an electronic component coupled to a substrate, the substrate coupled to a coldplate, a spring member disposed between and engaging both an underside of the electronic component and the coldplate, and a heat transfer element disposed within a chamber formed by the spring member.
1. A thermal management system for an electronic assembly, comprising:
an electronic component coupled to a substrate at an underside of the electronic component;
the substrate coupled to a coldplate;
a spring member disposed between and engaging both the underside of the electronic component and the coldplate; and
a heat transfer element disposed within a chamber formed by the spring member.
2. The system of claim 1 , wherein the electronic component comprises a ball grid array.
3. The system of claim 1 , wherein the electronic assembly comprises a space-based antenna.
4. The system of claim 1 , wherein the substrate comprises a circuit board.
5. The system of claim 1 , wherein the spring member comprises a pair of thin metal sheets coupled at their respective ends.
6. The system of claim 1 , wherein the heat transfer element comprises a wicking material.
7. The system of claim 1 , further comprising a fill port coupled to the chamber for delivering a fluid into the chamber.
8. The system of claim 1 , wherein a distance between the electronic component and the coldplate is no more than approximately 0.25 inch.
9. A thermal management method for an electronic assembly, comprising:
coupling an electronic component to a substrate at an underside of the electronic component;
coupling the substrate to a coldplate;
disposing a spring member between the electronic component and the coldplate such that the spring member engages both the underside of the electronic component and the coldplate; and
disposing a heat transfer element within a chamber formed by the spring member.
10. The method of claim 9 , wherein the electronic component comprises a ball grid array.
11. The method of claim 9 , wherein the electronic assembly comprises a space-based antenna.
12. The method of claim 9 , wherein coupling the electronic component to the substrate comprises coupling the electronic component to a circuit board.
13. The method of claim 9 , wherein the spring member comprises a pair of thin metal sheets coupled at their respective ends.
14. The method of claim 9 , wherein the heat transfer element comprises a wicking material.
15. The method of claim 9 , further comprising coupling a fill port to the chamber and delivering a fluid into the chamber.
16. The method of claim 9 , wherein a distance between the electronic component and the coldplate is no more than approximately 0.25 inch.
17. A thermal management system for an electronic assembly, comprising:
an integrated circuit coupled to a circuit board at an underside of the integrated circuit;
the circuit board coupled to a coldplate;
a spring member disposed between and engaging both the integrated circuit and the coldplate;
a wicking material disposed within a chamber formed by the spring member;
a fluid disposed within the chamber; and
wherein a first surface of the spring member applies a first force to the underside of the integrated circuit and a second surface of the spring member applies a second force to the coldplate such that the first surface remains engaged with the underside of the integrated circuit and the second surface remains engaged with the coldplate during operation of the electronic assembly.
18. The system of claim 17 , wherein the spring member comprises a pair of thin metal sheets coupled at their respective ends.
19. The system of claim 17 , wherein the wicking material comprises a wire mesh.
20. The system of claim 17 , further comprising a fill port coupled to the chamber for delivering the fluid into the chamber.