IP Library Granted Patent US 8,057,883
Granted Patent B2
US 8,057,883 · App. 11/936,265 · Granted Nov 15, 2011

Abrasive process for modifying corners, edges, and surfaces of capacitor anode bodies

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Quick Facts
Patent No.
US 8,057,883
App. No.
11/936,265
Granted
Nov 15, 2011
Kind
B2
Abstract

Porous sintered bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelepiped shapes are used as they were passed, cathode coverage at the sharp corners and edges is non-uniform and failures occur at those locations. Treating pressed anode bodies with an abrasive process alters the sharpness of corners and edges, creating rounded transitions between primary surfaces and remove surface imperfections resultant from the pressing process both of which enhance cathode layer uniformity.

Claims (19)

1. A capacitor precursor body comprising a pressed powder porous anode body which has been compacted and then subjected to an abrasion treatment process to remove corner material adjacent to at least one face thereby forming a corner adjacent said face with a radius of curvature of at least 0.0076 cm and wherein said capacitor precursor body further comprises a binder.

2. The capacitor precursor body of claim 1 comprising a conductor selected from a valve metal, a conductive oxide of said valve metal and a conductive nitride of said valve metal.

3. The capacitor precursor body of claim 2 wherein said valve metal is selected from the group consisting of Al, Ta, Nb, Ti, Zr, Hf, W.

4. The capacitor precursor body of claim 2 wherein said valve metal is selected from Ta, Nb and NbO.

5. The capacitor precursor body of claim 1 wherein said binder is selected from the group consisting of stearic acid, polyethylene carbonate, polypropylene carbonate, N,N′-ethylene diamine distearamide, alkyl resin, polyethylene glycol, ammonium barbonate, polybutyl methacrylate, chamfor, polypropylene carbonate and dimethyl sulfone.

6. The capacitor precursor body of claim 1 wherein the abrasive treatment process is selected from the group consisting of tumbling, vibrating, blasting and grinding.

7. The capacitor precursor body of claim 6 where said pressed powder porous anode body has been tumbled.

8. The capacitor precursor body of claim 1 wherein said pressed powder porous anode body has been tumbled in a grinding media.

9. The capacitor precursor body of claim 8 wherein said grinding media is selected from the group consisting of sand, metal/ceramic beads, pellets if same material as said body, Al 2 O 3 pellets, SiC pellets, Zr pellets, synthetic plastic fragments, nut shells and ground hardwood.

10. The capacitor precursor body of claim 1 wherein said pressed powder porous anode body has been sintered.

11. The capacitor precursor body of claim 1 wherein said pressed powder porous anode body has been tumbled in a rotary jar.

12. The capacitor precursor body of claim 11 wherein said tumbling is prior to sintering.

13. The capacitor precursor body of claim 1 further comprising a dielectric.

14. The capacitor precursor body of claim 13 further comprising a conductive layer on said dielectric.

15. The capacitor precursor body of claim 14 wherein said conductive layer is a polymer.

16. A capacitor precursor body comprising a pressed powder porous anode body which has been compacted and then subjected to an abrasion treatment process wherein said pressed powder porous anode body has a minimum radius of curvature at a corner between adjacent faces of at least 0.0076 cm.

17. The capacitor precursor body of claim 16 wherein said curvature is least 0.0127 cm.

18. The capacitor precursor body of claim 17 wherein said curvature is least 0.025 cm.

19. A capacitor precursor body comprising a compacted powder porous anode body wherein said compacted powder porous anode body has been subjected to an abrasion treatment process and wherein an edge between adjacent faces of said compacted powder porous anode body has a minimum radius of curvature of at least 0.0076 cm.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 8, 2018
From: BANK OF AMERICA, N.A.
To: KEMET CORPORATION,; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
Reel/Frame 047450/0926 →
SECURITY AGREEMENT Recorded May 22, 2017
From: KEMET CORPORATION; KEMET ELECTRONICS CORPORATION; KEMET BLUE POWDER CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 042523/0639 →
SECURITY AGREEMENT Recorded Mar 19, 2013
From: KEMET ELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 030055/0049 →
SECURITY INTEREST Recorded Oct 5, 2010
From: KEMET ELECTRONICS CORPORATION
To: BANK OF AMERICA, N.A. AS AGENT
Reel/Frame 025150/0023 →
RELEASE OF SECURITY INTEREST RECORDED AT REEL/FRAME 022892/0795 Recorded May 18, 2010
From: K FINANCING, LLC
To: KEMET CORPORATION
Reel/Frame 024397/0774 →
SECURITY AGREEMENT Recorded Jul 1, 2009
From: KEMET CORPORATION
To: K FINANCING, LLC
Reel/Frame 022892/0795 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2007
From: THORNTON, LANCE P
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 020117/0201 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2007
From: POLTORAK, JEFFREY; GUERRERO, CHRISTIAN; QUI, YONGJIAN
To: KEMET ELECTRONICS CORPORATION
Reel/Frame 020079/0291 →