Novel epoxy hardeners with improved cure and polymers with enhanced coating properties

1 . A curable formulation consisting essentially of:

a hardener composition comprising:

(a) 1,3-bis(aminomethyl)cyclohexane; and

(b) 1,4-bis(aminomethyl)cyclohexane; and

an epoxy resin

2 . The curable formulation of claim 1 , wherein the hardener composition comprises cis and trans isomers of at least one of component (a) and component (b).

3 . The curable formulation of claim 1 , wherein the hardener composition comprises cis and trans isomers of both component (a) and component (b).

4 . The curable formulation of claim 1 , wherein the hardener composition comprises at least 5 weight percent component (b) based on a total weight of component (a) and component (b).

5 . The curable formulation of claim 1 , wherein the hardener composition comprises about 50 weight percent component (b) based on a total weight of component (a) and component (b).

6 . The curable formulation of claim 2 , wherein the hardener composition comprises:

1 to 97 weight percent cis 1,3-bis(aminomethyl)cyclohexane;

1 to 97 weight percent trans 1,3-bis(aminomethyl)cyclohexane;

1 to 97 weight percent cis 1,4-bis(aminomethyl)cyclohexane; and

1 to 97 weight percent trans 1,4-his(aminomethyl)cyclohexane;

wherein the above percentages are based upon a total weight of the cis 1,3-bis(aminomethyl)cyclohexane, the trans 1,3-bis(aminomethyl)cyclohexane, the cis 1,4-bis(aminomethyl)cyclohexane, and the trans 1,4-bis(aminomethyl)cyclohexane.

7 . The curable formulation of claim 1 , wherein the hardener comprises 50-100 weight percent of a mixture of (a) and (b), 0 to 30 weight percent of a bicyclic amine, 0 to 25 weight percent of a bicyclic diamine, and 0 to about 15 weight percent of a bicyclic imime.

8 . The curable formulation of claim 1 , wherein the hardener comprises 50-100 weight percent of a mixture of (a) and (b), and at least one of the following three bicyclic compounds: (i) greater than 0 to about 30 weight percent of a bicyclic amine, (ii) greater than 0 to about 25 weight percent of a bicyclic diamine, and (iii) greater than 0 to about 15 weight percent of a bicyclic imine,

9 . A method for adhering two substrates, comprising:

applying curable formulation of claim 1 to one or both of the substrates; and

bringing the substrates into a contacting relationship.

10 . The method of claim 9 , further comprising curing the epoxy resin at a temperature fix a time sufficient to cure the epoxy resin.

11 . The method of claim 10 , wherein the curing temperature is between about −20° C. to 100° C.

12 . The method of claim 10 , wherein the curing time is less than 24 hours.

13 . A method for coating a substrate, comprising:

applying a coating composition to a substrate;

wherein the coating composition includes the curable formulation of claim 1 .