Hybrid discoidal/tubular capacitor
View Patent ↗A hybrid capacitor includes a body of dielectric material having spaced-apart first and second surfaces. A first electrode is associated with the first surface. A second electrode is associated with the second surface. One or more third electrodes are transversely disposed within the dielectric body between the first and second electrodes. Either the first or second electrode is not conductively coupled to any electrode transversely extending into the body. The resulting arrangement provides a hybrid capacitor having characteristics of both a tubular capacitor and a discoidal capacitor.
1. A hybrid capacitor, comprising:
a body of dielectric material having spaced-apart first and second surfaces;
a first electrode associated with the first surface;
a second electrode associated with the second surface; and
a plurality of third electrodes transversely disposed within the dielectric body between the first and second electrodes;
wherein free ends of the plurality of third electrodes are in generally equally spaced relation to at least one of the first and second electrodes;
wherein the first, second and third electrodes cooperatively have the characteristics of a tubular capacitor; and
wherein at least one of the first and second electrodes is not conductively coupled to any electrode transversely extending into the body.
2. The capacitor of claim 1 , wherein the third electrodes are disposed within the dielectric body without conductive coupling to the first or second electrodes.
3. The capacitor of claim 1 , wherein the third electrodes are conductively coupled to the first electrode.
4. The capacitor of claim 1 , wherein the third electrodes are conductively coupled to the second electrode.
5. The capacitor of claim 1 , wherein the third electrode comprises a set of electrode plates.
6. The capacitor of claim 5 , wherein a first plurality of the electrode plates are conductively coupled to either the first or second electrode, and a second plurality of the electrode plates are interleaved with the first plurality of electrode plates and are not conductively coupled to either the first or second electrode.
7. The capacitor of claim 1 , wherein the dielectric body defines a chip capacitor.
8. The capacitor of claim 7 , wherein the first electrode comprises a surface metallization on a first end of the chip capacitor, and the second electrode comprises a surface metallization on a generally opposite second end of the chip capacitor.
9. The capacitor of claim 1 , wherein the dielectric body defines a feedthrough capacitor.
10. The capacitor of claim 9 , wherein the first electrode comprises a surface metallization disposed on a surface of the dielectric body defining a lead wire passageway, and the second electrode comprises an outer surface metallization.
11. The capacitor of claim 1 , wherein the dielectric body defines a feedthrough capacitor having a plurality of lead wire passageways therethrough.
12. The capacitor of claim 11 , wherein the first electrode collectively comprises surface metallizations disposed on surfaces of the dielectric body defining the plurality of lead wire passageways, and wherein the second electrode comprises an outer surface metallization.