Pattern transcription device and method of fabricating cliché for the same
View Patent ↗A pattern transcription apparatus comprises a cliché including a concave portion, a convex portion and a printing stopper, the printing stopper formed on a bottom surface of the concave portion; and a blanket, on which a resist material layer is coated, rotatable on the cliché, wherein a surface energy density of the blanket is greater than a surface energy density of the printing stopper and is smaller than a surface energy of the cliché.
1. A method of fabricating a cliché for a pattern transcription apparatus, comprising:
forming a metal pattern on a substrate;
forming a photosensitive material pattern on the metal pattern;
etching the substrate using the metal pattern and the photosensitive material pattern as an etching mask to form a concave portion having a desired depth and a convex portion without etching the metal pattern, wherein the substrate has a first thickness in the concave portion and a second thickness, which is larger than the first thickness, in the convex portion;
removing the photosensitive material pattern and the metal pattern from the substrate including the concave portion and the convex portion;
forming a low surface energy material layer on the substrate including the concave portion and the convex portion, the low surface energy material layer having a third thickness in the concave portion and a fourth thickness, which is smaller than the third thickness, in the convex portion; and
removing the low surface energy material layer in the convex portion and the concave portion by the fourth thickness to expose the substrate in the convex portion and to form a printing stopper in the concave portion, thereby forming the cliché having the concave portion with the desired depth and with the printing stopper in the concave portion,
wherein the printing stopper has a surface energy density smaller than the substrate.
2. The method according to claim 1 , wherein the printing stopper has a height from a bottom surface of the substrate.
3. The method according to claim 1 , wherein the step of forming the metal pattern comprises:
forming a metal layer on the substrate and a photosensitive material layer on the metal layer;
exposing the photosensitive material layer using a mask;
developing the photosensitive material layer to form the photosensitive material pattern; and
etching the metal layer using the photosensitive material pattern as an etching mask to form the metal pattern on the substrate.