SEMICONDUCTOR DEVICE
A semiconductor device includes a power device formed on a semiconductor substrate; a plurality of transistors formed on the semiconductor substrate; a first insulating film formed on the semiconductor substrate so as to cover the power device and the plurality of transistors; an interconnect layer formed on the first insulating film and including a second insulating film, an interconnect formed in the second insulating film and dummy patterns formed in the second insulating film in a region where the interconnect is not formed; and a power electrode corresponding to an uppermost layer interconnect formed on the interconnect layer and electrically connected to the power device. It further includes uppermost layer dummy patterns uniformly provided on the interconnect layer in a region where the uppermost layer interconnect is not formed.
1 . A semiconductor device comprising:
a power device formed on a semiconductor substrate;
a plurality of transistors formed on the semiconductor substrate;
a first insulating film formed on the semiconductor substrate so as to cover the power device and the plurality of transistors;
an interconnect layer formed on the first insulating film and including a second insulating film, an interconnect formed in the second insulating film and dummy patterns formed in the second insulating film in a region where the interconnect is not formed;
a power electrode corresponding to an uppermost layer interconnect formed on the interconnect layer and electrically connected to the power device; and
uppermost layer dummy patterns uniformly provided on the interconnect layer in a region where the uppermost layer interconnect is not formed.
2 . The semiconductor device of claim 1 ,
wherein the uppermost layer interconnect has a larger thickness than the interconnect.
3 . The semiconductor device of claim 2 ,
wherein the uppermost layer interconnect has a thickness three times or more as large as a thickness of the interconnect.
4 . The semiconductor device of claim 1 ,
wherein the uppermost layer interconnect is made of Cu.
5 . The semiconductor device of claim 1 ,
wherein the power electrode has a slit.
6 . The semiconductor device of claim 1 , further comprising a bonding pad corresponding to the uppermost layer interconnect formed on the interconnect layer.
7 . The semiconductor device of claim 6 ,
wherein the bonding pad has a slit.
8 . The semiconductor device of claim 6 ,
wherein the dummy patterns are uniformly provided in a region of the second insulating film where the interconnect is not formed excluding a region disposed below the bonding pad.
9 . The semiconductor device of claim 1 , further comprising a testing monitor pad corresponding to the uppermost layer interconnect formed on the interconnect layer,
wherein the testing monitor pad is provided to be distinguishable from the uppermost layer dummy patterns.
10 . The semiconductor device of claim 9 ,
wherein the testing monitor pad is in a different shape from the uppermost layer dummy patterns.