Solid-state imaging device, method of making the same, and imaging apparatus
View Patent ↗A solid-state imaging device includes the following elements. A photoelectric conversion section is arranged in a semiconductor layer having a first surface through which light enters the photoelectric conversion section. A signal circuit section is arranged in a second surface of the semiconductor layer opposite to the first surface. The signal circuit section processes signal charge obtained by photoelectric conversion by the photoelectric conversion section. A reflective layer is arranged on the second surface of the semiconductor layer opposite to the first surface. The reflective layer reflects light transmitted through the photoelectric conversion section back thereto. The reflective layer is composed of a single tungsten layer or a laminate containing a tungsten layer.
1. A solid-state imaging device comprising:
a photoelectric conversion section arranged in a semiconductor layer having a first surface through which light enters the photoelectric conversion section;
an insulating layer formed on the photoelectric conversion section;
a signal circuit section arranged in a second surface of the semiconductor layer facing away from the first surface, the signal circuit section processing signal charge obtained by photoelectric conversion by the photoelectric conversion section; and
a reflective layer arranged on the second surface of the semiconductor layer opposite to the first surface, the reflective layer reflecting light transmitted through the photoelectric conversion section back thereto; and,
an interconnection layer having a cross section in which an interconnect line is in contact with the reflective layer,
wherein,
the reflective layer is composed of a single tungsten layer or a laminate containing a tungsten layer, and
the reflective layer is sandwiched between the interconnect line and said second surface.
2. The device according to claim 1 , wherein a bias voltage is applied to the polysilicon electrode layer through the reflective layer.
3. The device according to claim 1 , wherein
the reflective layer is arranged over a periphery of the photoelectric conversion section, and
an interconnection layer extends over the photoelectric conversion section.
4. The device according to claim 3 , wherein
the interconnection layer extending over the photoelectric conversion section has a function of reflecting light transmitted through the photoelectric conversion section back thereto, and
the interconnection layer is composed of a single tungsten layer or a laminate containing a tungsten layer.
5. The device according to claim 1 , wherein the reflective layer is formed by filling a hole in the insulating layer over the photoelectric conversion section.
6. The device according to claim 1 , wherein the reflective layer is arranged on at least the inner surface of a hole in the insulating layer over the photoelectric conversion section.
7. An imaging apparatus comprising:
a collection optical unit that collects incident light;
a solid-state imaging device that receives the light collected by the collection optical unit and converts the light into an electrical signal; and
a signal processing unit that processes the electrical signal,
wherein
the solid-state imaging device includes
a photoelectric conversion section arranged in a semiconductor layer having a first surface through which light enters the photoelectric conversion section,
an insulating layer formed on the photoelectric conversion section;
a signal circuit section arranged in a second surface of the semiconductor layer facing away from the first surface, the signal circuit section extracting the electrical signal obtained by the photoelectric conversion section, and
a reflective layer arranged on the second surface of the semiconductor layer opposite to the first surface, the reflective layer reflecting light transmitted through the photoelectric conversion section back thereto, and
an interconnection layer having a cross section in which an interconnect line is in contact with the reflective layer,
wherein,
the reflective layer is composed of a single tungsten layer or a laminate containing a tungsten layer, and
the reflective layer is sandwiched between the interconnect line and said second surface.
8. The imaging apparatus according to claim 7 , wherein
the interconnection layer extending over the photoelectric conversion section has a function of reflecting light transmitted through the photoelectric conversion section back thereto, and
the interconnection layer is composed of a single tungsten layer or a laminate containing a tungsten layer.