IP Library Granted Patent US 7,589,966
Granted Patent B2
US 7,589,966 · App. 11/947,048 · Granted Sep 15, 2009

Low-cost, self-aligning, blind mating, tool-less fan module

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Quick Facts
Patent No.
US 7,589,966
App. No.
11/947,048
Granted
Sep 15, 2009
Kind
B2
Abstract

A fan module, including a housing for receiving a fan, a connector configured to mate with a connector housing, and a vibration pad configured to isolate vibrations of the fan from transferring through the fan module, wherein the fan module is configured to receive an alignment attachment standoff.

Claims (23)

1. A fan module, comprising:

a housing for receiving a fan;

a connector configured to mate with a connector housing,

a vibration pad configured to isolate vibrations of the fan from transferring through the fan module, and

a fan extraction tab configured to facilitate removal of the fan module,

wherein the fan module is configured to receive an alignment attachment standoff.

2. The fan module of claim 1 , wherein the fan module is made of one selected from a group consisting of sheet metal, rubber, and plastic.

3. The fan module of claim 1 , wherein the connector is a self-aligning, floating connector configured to dampen the vibrations of the fan.

4. The fan module of claim 1 , wherein a height of a space into which the fan is installed is less than a combined height of the fan module and an undeformed vibration pad.

5. The fan module of claim 1 , wherein the fan module is a self-aligning, blind-mating fan module.

6. The fan module of claim 1 , wherein the connector functions as a retention snap for the fan module.

7. The fan module of claim 1 , wherein the fan extraction tab is further configured to identify a type of fan housed by the fan module.

8. The fan module of claim 1 , wherein the fan extraction tab is made from one selected from a group consisting of plastic, metal, wood, rubber, laminate, and foam.

9. The fan module of claim 1 , wherein the fan extraction tab is one selected from a group consisting of a ring, a handle, and an elongated tab.

10. The fan module of claim 1 , wherein the vibration pad is made using one selected from a group consisting of rubber, elastomer, foam, and plastic.

11. The fan module of claim 1 , wherein the fan module comprises at least two vibration pads.

12. The fan module of claim 1 , wherein the fan module is configured to be installed in a computer chassis.

13. The fan module of claim 12 , wherein the alignment attachment standoff is located on a wall of the computer chassis.

14. The fan module of claim 1 , wherein the fan module is configured to receive at least two alignment attachment standoffs.

15. The fan module of claim 1 , wherein the fan is retained in the housing of the fan module using at least one screw.

16. The fan module of claim 1 , wherein the housing snaps onto the fan.

17. The fan module of claim 1 , wherein the alignment attachment standoff is round.

18. The fan module of claim 1 , wherein the housing comprises one selected from a group consisting of a channel, a track, and a slot for receiving the alignment attachment standoff.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037304/0194 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2007
From: ONG, BRETT C.; BROVALD, RUSSELL K.; CISNEROZ, JAY
To: SUN MICROSYSTEMS, INC.
Reel/Frame 020182/0127 →