Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
View Patent ↗An arrangement may include a substrate and an electrical component. The electrical component may include a base made of an insulating material and a plurality of connection terminals. Each connection terminal is connected to a corresponding connection pad of the substrate by means of a spot of solder paste. The arrangement may further include a block interposed between the substrate and the base of the electrical component. The block may be located substantially on the axis of application of a force for actuating the electrical component and may be designed to inhibit deformation of the base. The block may include a spot of solder paste soldered to an associated conducting pad on the substrate.
1. A device comprising:
a substrate comprising an upper face comprising a plurality of conducting connection pads;
an electrical component comprising:
a base comprising insulating material bounded by a lower face extending opposite to a portion of the upper face of the substrate,
an electrical switch wherein the base defines a cavity, wherein the cavity is open on an upper face of the base, wherein the electrical switch further comprises:
at least one central fixed contact, wherein each central fixed contact is disposed in the cavity,
at least one lateral fixed contact, wherein each lateral fixed contact is disposed in the cavity, and
a generally dome-shaped trip member received in the cavity and the periphery of the base, wherein the trip member is in electrical contact with the at least one lateral fixed contact, wherein the trip member is configured to be elastically deformable in order to establish an electrical connection between the at least one central fixed contact and the at least one lateral fixed contact when the member is subjected to an actuation force; and
a plurality of connection terminals arranged on a periphery of the base, wherein each connection terminal is electrically connected to a corresponding conducting connection pad of the upper face of the substrate using a spot of solder paste,
wherein the electrical component is configured to be subjected to an actuation force applied along a direction generally orthogonal to the lower face of the base; and
a block interposed vertically between the upper face of the substrate and a facing portion of the lower face of the base of the electrical component, wherein the block is located substantially in line with an axis of application of the actuation force, wherein the block is configured to inhibit deformation of the base, wherein the block comprises a spot of solder paste soldered to a conducting pad associated with the upper face of the substrate.
2. The device of claim 1 , wherein the facing portion of the lower face of the base of the electrical component comprises a conducting mount configured to be soldered to the block.
3. The device of claim 1 , wherein the facing portion of the lower face of the base comprises insulating material.
4. The device of claim 1 , wherein the facing portion of the lower face of the base is shaped to cooperate with the block.
5. The device of claim 4 , wherein the facing portion of the lower face of the base includes a central body that accommodates an upper portion of the block.
6. The device of claim 4 , wherein the facing portion of the lower face of the base includes a point configured to be accommodated in an upper portion of the block.
7. The device of claim 1 , wherein the base is rectangularly shaped, wherein the base further comprises a connection terminal at each corner of the base.