Electronic elements carrier
An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element.
1. An electronic elements carrier comprising:
a body including a substrate having a plate and a dam formed on the periphery of the plate, a conductive layer mounted on an upper surface of the dam of the substrate, at least one cavity defined by the plate and the dam of the substrate;
a plurality of electronic elements disposed in the cavity of the body; a conductive liner formed in the cavity of the substrate and extended along a surface of the plate and an inner-sidewall of the dam to the upper surface of the dam to electrically connect the conductive layer and the electronic elements received in the cavity;
wherein the substrate further includes a separator formed in the cavity of the substrate to space the electronic elements received in the cavity of the substrate from each other, and
a filler received in the cavity of the substrate for encapsulating, sealing and protecting the electronic elements.
2. The electronic elements carrier as claimed in claim 1 , wherein the separator includes a top surface sharing a coplanar surface with the substrate, a part of the conductive layer is positioned on the top surface of the separator.
3. The electronic elements carrier as claimed in claim 1 , wherein the separator and the substrate integrates as one body.
4. The electronic elements carrier as claimed in claim 1 , wherein the electronic elements carrier further includes another body, and the two bodies have the same structure and are connected with each other.
5. The electronic elements carrier as claimed in claim 1 , wherein the body is a printed circuit board, and the electronic elements are selected from decoupling capacitors, resistors, and inductors.
6. The electronic elements carrier as claimed in claim 1 , wherein the filler is filled in the cavity to form a coplanar surface with the substrate.
7. The electronic elements carrier as claimed in claim 1 , wherein the conductive layer attached on the top surface of the separator and the surface of the substrate form a ball grid array of bonding pads.
8. The electronic elements carrier as claimed in claim 4 , wherein the conductive layer of one body and the conductive layer of another body are electrically connected with each other via a number of through holes formed in the substrate.
9. The electronic elements carrier as claimed in claim 8 , wherein a mask layer is formed on the conductive layer, the conductive layer includes a number of bonding pads exposed through the mask layer.