IP Library Granted Patent US 7,687,938
Granted Patent B2
US 7,687,938 · App. 11/948,817 · Granted Mar 30, 2010

Superconducting shielding for use with an integrated circuit for quantum computing

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Quick Facts
Patent No.
US 7,687,938
App. No.
11/948,817
Granted
Mar 30, 2010
Kind
B2
Abstract

An integrated circuit for quantum computing may include a superconducting shield to limit magnetic field interactions.

Claims (64)

1. An integrated circuit for quantum computing comprising:

a first metal layer including

at least a portion of a first superconducting qubit and

at least a portion of a second superconducting qubit;

a second metal layer including

a superconducting plane,

wherein at least a portion of the superconducting plane underlies the at least a portion of the first superconducting qubit and the at least a portion of the second superconducting qubit to form

a shielded region of the integrated circuit,

the at least a portion of the first superconducting qubit and the at least a portion of the second superconducting qubit are magnetically isolated from one another within the shielded region; and

a first dielectric layer between at least a portion of the first metal layer and at least a portion of the second metal layer.

2. The integrated circuit of claim 1 wherein the first superconducting qubit and the second superconducting qubit do not use the superconducting plane as a ground plane.

3. The integrated circuit of claim 1 further comprising at least one additional dielectric layer and at least one additional metal layer.

4. The integrated circuit of claim 1 wherein the first metal layer and the second metal layer are each composed of a superconducting material.

5. The integrated circuit of claim 4 wherein the superconducting material is selected from the group consisting of aluminium and niobium.

6. The integrated circuit of claim 1 wherein a distance separating the at least a portion of the first superconducting qubit and the at least a portion of the second superconducting qubit is less than two times a distance separating the first metal layer and the second metal layer.

7. The integrated circuit of claim 1 , further comprising;

a second portion of the first superconducting qubit and

a second portion of the second superconducting qubit,

wherein the superconducting plane does not underlie the second portion of the first superconducting qubit and the second portion of the second superconducting qubit, to thereby form an unshielded region of the integrated circuit, and wherein

the second portion of the first superconducting qubit and the second portion of the second superconducting qubit are not magnetically isolated from one another within the unshielded region.

8. The integrated circuit of claim 1 ,

wherein the first metal layer includes

at least a portion of a third superconducting qubit and

at least a second portion of the first superconducting qubit, and

wherein the superconducting plane does not underlie the at least a portion of the third superconducting qubit and the second portion of the first superconducting qubit,

to thereby form an unshielded region of the integrated circuit, and

wherein the third superconducting qubit and the first superconducting qubit are magnetically coupled to one another within the unshielded region.

9. The integrated circuit of claim 1 wherein at least one of the first superconducting qubit and the second superconducting qubit is a superconducting flux qubit.

10. The integrated circuit of claim 1 wherein the superconducting plane is sized and positioned so that the shielded region covers a majority of the integrated circuit.

11. The integrated circuit of claim 1 wherein the first dielectric layer has a thickness within the range of 50 nm to 1000 nm.

12. The integrated circuit of claim 1 wherein at least one of the first metal layer and the second metal layer has a thickness within the range of 50 nm to 500 nm.

13. An integrated circuit for quantum computing comprising:

a first superconducting qubit;

a second superconducting qubit;

a superconducting metal layer; and

a dielectric layer that separates the superconducting metal layer from both the first superconducting qubit and the second superconducting qubit,

wherein at least a portion of the superconducting metal layer underlies

at least a portion of the first superconducting qubit and

at least a portion of the second superconducting qubit,

wherein the at least a portion of the superconducting metal layer shields a shielded region of the integrated circuit, and

wherein a magnetic field produced by the first superconducting qubit within the shielded region is attenuated in proportion to 1/r 3 ,

where r is a distance from the first superconducting qubit.

14. The integrated circuit of claim 13 , further comprising:

an unshielded region of the integrated circuit in which the superconducting metal layer does not underlie

a second portion of the first superconducting qubit and

a second portion of the second superconducting qubit,

and wherein a magnetic field produced by the first superconducting qubit within the unshielded region is attenuated in proportion to 1/r.

15. The integrated circuit of claim 14 wherein the first superconducting qubit and the second superconducting qubit are magnetically coupled within the unshielded region.

16. The integrated circuit of claim 13 wherein the first superconducting qubit and the second superconducting qubit do not use the superconducting metal layer as a ground plane.

17. The integrated circuit of claim 13

wherein the first superconducting qubit, the second superconducting qubit, and the superconducting metal layer are each comprised of

a superconducting material that is selected from the group consisting of aluminium and niobium.

18. The integrated circuit of claim 13 wherein the first superconducting qubit and the second superconducting qubit are magnetically isolated from each other in the shielded region.

19. The integrated circuit of claim 13 wherein at least one of the first superconducting qubit and the second superconducting qubit is a superconducting flux qubit.

20. The integrated circuit of claim 13

wherein the superconducting metal layer is sized and positioned so that the shielded region covers a majority of the integrated circuit.

21. The integrated circuit of claim 13 wherein the superconducting metal layer has a thickness within the range of 50 nm to 500 nm.

22. The integrated circuit of claim 13 , further comprising:

a third superconducting qubit,

wherein the dielectric layer separates the superconducting metal layer from the third superconducting qubit, and

the superconducting metal layer does not underlie

at least a portion of the third superconducting qubit and

a second portion of the first superconducting qubit, to thereby define an unshielded region of the integrated circuit characterized in that a magnetic field produced by the first superconducting qubit within the unshielded region is attenuated in proportion to 1/r.

23. The integrated circuit of claim 22 wherein the third superconducting qubit and the first superconducting qubit are magnetically coupled to one another in the unshielded region.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2025
From: PSPIB UNITAS INVESTMENTS II INC.
To: D-WAVE SYSTEMS INC.; 1372934 B.C. LTD.
Reel/Frame 070470/0098 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Apr 14, 2023
From: D-WAVE SYSTEMS INC.; 1372934 B.C. LTD.
To: PSPIB UNITAS INVESTMENTS II INC., AS COLLATERAL AGENT
Reel/Frame 063340/0888 →
RELEASE OF SECURITY INTEREST Recorded Sep 20, 2022
From: PSPIB UNITAS INVESTMENTS II INC., IN ITS CAPACITY AS COLLATERAL AGENT
To: D-WAVE SYSTEMS INC.
Reel/Frame 061493/0694 →
SECURITY INTEREST Recorded Mar 3, 2022
From: D-WAVE SYSTEMS INC.
To: PSPIB UNITAS INVESTMENTS II INC.
Reel/Frame 059317/0871 →
SECURITY INTEREST Recorded Nov 29, 2019
From: D-WAVE SYSTEMS INC.
To: BDC CAPITAL INC.
Reel/Frame 051144/0499 →
SECURITY INTEREST Recorded Mar 22, 2019
From: D-WAVE SYSTEMS INC.
To: BDC CAPITAL INC.
Reel/Frame 048674/0188 →
RELEASE OF SECURITY INTEREST Recorded Apr 13, 2017
From: VENTURE LENDING & LEASING VI, INC.; VENTURE LENDING & LEASING VII, INC.
To: D-WAVE SYSTEMS INC.
Reel/Frame 042252/0256 →
CORRECTIVE ASSIGNMENT TO REMOVE APPL. NO. 8733763 PREVIOUSLY RECORDED AT REEL: 034841 FRAME: 0497. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT. Recorded Jan 30, 2015
From: D-WAVE SYSTEMS INC.
To: VENTURE LENDING & LEASING VI, INC.; VENTURE LENDING & LEASING VII, INC.
Reel/Frame 034862/0237 →
SECURITY INTEREST Recorded Jan 29, 2015
From: D-WAVE SYSTEMS INC.
To: VENTURE LENDING & LEASING VI, INC.; VENTURE LENDING & LEASING VII, INC.
Reel/Frame 034841/0497 →