Method of manufacturing display substrate, method of patterning inorganic layer and method of manufacturing display device using the same

1. A method of manufacturing a display substrate, the method comprising:

forming a plurality of thin film transistors (TFTs) on a first substrate in a matrix;

forming a plurality of pixel electrodes connected to the TFTs, and a connecting pad to receive a common voltage;

forming an organic pattern on the connecting pad;

depositing an inorganic alignment layer covering the organic pattern on the first substrate; and

removing the organic pattern to remove the inorganic alignment layer that is remaining on the organic pattern.

2. The method of claim 1 , further comprising:

forming transmission lines to transmit driving signals to the TFTs, a plurality of transmission pads disposed at a terminal portion of the transmission lines, and a common voltage pad electrically connected to the connecting pads.

3. The method of claim 1 , wherein forming the organic pattern comprises:

forming a seal coat to cover the connecting pads and the common voltage pad; and

forming a short point to cover the connecting pads.

4. The method of claim 2 , wherein the connecting pads comprise a plurality of gate transmission pads and a plurality of data transmission pads, and wherein the gate transmission pads comprise a layer different from a layer of the data transmission layer.

5. The method of claim 4 , wherein the common voltage pad comprises the same as or substantially the same layer as a layer of the data transmission pads.

6. The method of claim 5 , further comprising:

forming a common electrode on a second substrate;

forming an organic pattern on the common electrode;

depositing an inorganic alignment layer on the common electrode covering the organic pattern; and

removing the organic pattern and the organic alignment layer remaining on the organic pattern.

7. The method of claim 6 , wherein removing the organic pattern comprises forming a contact hole in the inorganic alignment layer to partially expose the common electrode.

8. A method of patterning an inorganic layer, the method comprising:

forming an organic material to form an organic pattern on a first substrate;

depositing an inorganic layer on the first substrate to cover the organic pattern; and

lifting off the inorganic layer that is remaining on the organic pattern by removing the organic pattern.

9. The method of claim 8 , wherein the organic pattern comprises a photoresist.

10. The method of claim 9 , wherein the organic pattern is removed using a developing agent.

11. The method of claim 8 , wherein the organic pattern comprises a water-soluble synthetic resin.

12. The method of claim 11 , wherein the water-soluble synthetic resin comprises PVA, polyacryamide, a methylol urea resin, a methylol melamine resin, and carboxymethylcellulose CMC.

13. The method of claim 12 , wherein the organic pattern is removed using at least one of ultra pure water or deionized water.

14. The method of claim 8 , wherein the organic material is dropped on the first substrate through a nozzle.

15. The method of claim 8 , wherein the inorganic material comprises an alignment layer.

16. The method of claim 15 , wherein the inorganic material comprises silicon oxide.

17. The method of claim 16 , wherein a height of the organic pattern is higher than a thickness of the inorganic material by more than about 1000 times.

18. A method of manufacturing a display device, the method comprising:

forming a connecting pad on a first substrate to apply a common voltage;

forming a lower organic pattern on the connecting pad;

depositing a lower alignment layer on the first substrate covering the lower organic pattern;

removing the lower organic pattern partially exposing the common electrode;

forming a common electrode on a second substrate and an upper alignment layer on the common electrode, wherein the upper alignment layer includes a contact hole partially exposing the common electrode;

forming a sealant interposed between the lower alignment layer and the upper alignment layer;

forming a connecting spacer between the connecting pad and the common electrode electrically connecting the connecting pad and the common electrode through the contact hole; and

forming a liquid crystal layer between the lower alignment layer and the upper alignment layer, wherein the liquid crystal layer is sealed by the sealant.

19. The method of claim 18 , wherein forming the connecting pad comprises:

forming a TFT on a first substrate;

forming a pixel electrode connected to the TFT;

forming a transmission line to transmit a driving signal to the TFT, and a transmission pad connected to a terminal portion of the transmission line.