IP Library Granted Patent US 7,595,982
Granted Patent B2
US 7,595,982 · App. 11/950,258 · Granted Sep 29, 2009

Low airflow impedance PCBA handling device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,595,982
App. No.
11/950,258
Granted
Sep 29, 2009
Kind
B2
Abstract

A computer server includes a printed circuit board and a fan. The printed circuit board includes electronic components and a handling device mounted thereon. The fan is arranged to blow air across the electronic components mounted on the printed circuit board. The handling device is disposed in a path of airflow of the fan. The handling device comprises an airflow opening.

Claims (16)

1. A computer server, comprising:

a printed circuit board comprising electronic components and a printed circuit board handling device mounted thereon; and

a fan arranged to blow air across the electronic components mounted on the printed circuit board,

wherein the handling device is disposed in a path of airflow of the fan, and

wherein the handling device comprises an airflow opening.

2. The computer server of claim 1 wherein the computer server is a blade server.

3. The computer server of claim 2 , wherein the blade server has a 1U height.

4. The computer server of claim 2 , wherein the blade server has a 2U height.

5. The computer server of claim 1 , wherein the electronic components comprise a central processing unit, memory, and input/output components.

6. The computer server of claim 1 , wherein the handling device comprises a circular ring.

7. The computer server of claim 1 , wherein the handling device comprises a D-shaped ring.

8. The computer server of claim 1 , wherein the airflow opening is tapered in a direction of the path of airflow of the fan.

9. The computer server of claim 1 , wherein the handling device is disposed in between the fan and at least one of the electronic components mounted on the printed circuit board.

10. The computer server of claim 1 , wherein the printed circuit board is a motherboard.

11. The computer server of claim 1 , wherein the handling device comprises a cable management device.

12. The computer server of claim 1 , further comprising a plurality of fans.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037304/0194 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2007
From: ONG, BRETT C.; OLESIEWICZ, TIMOTHY W.; WILLIS, CLIFFORD B.
To: SUN MICROSYSTEMS, INC.
Reel/Frame 020200/0254 →