Flexible substrate tensioner

1. A method of tensioning at least one of a base film, a flexible wafer, and a printed circuit board mounted on a frame, the method comprising:

providing a clamp including:

a plurality of knife edges; and

a plurality of feet extending from the clamp;

providing a pallet holding the frame, the pallet including:

a top member; and

a guide ring; and

manipulating the clamp with the pallet so that the at least one of the base film, the flexible wafer, and the flexible printed circuit board is stretched by the pallet as the clamp is drawn downward by the guide ring as it rotates relative to the top member of the pallet.

2. The method of claim 1 , further comprising pushing down with the knife edges on the at least one of the base film, the flexible wafer, and the flexible printed circuit board to tension it as the feet advancingly interact with the pallet.

3. The method of claim 2 , wherein the provided pallet further includes a pawl, the method further comprising rotating the guide ring relative to the top member and holding the guide ring in position by the pawl.

4. The method of claim 3 , wherein the top member further comprises a mandrel, and a plurality of holes, the method further comprising pushing the mandrel upon the flexible substrate in a direction opposite the knife edges as the plurality of feet advancingly interact with the pallet through the plurality of holes.

5. The method of claim 4 , wherein the guide ring further comprises a plurality of grooves and a plurality of teeth, the method further comprising the plurality of grooves interacting with the plurality of feet and guiding advancement of the plurality of feet, the method further comprising the plurality of teeth interacting with the pawl to stop movement of the clamp toward the pallet and secure the flexible substrate in a tensioned condition.

6. The method of claim 2 , wherein the tensioning of the substrate occurs evenly.