Vertical type CMOS image sensor and fabricating method thereof
View Patent ↗A vertical-type CMOS image sensor and a fabricating method thereof by which capacitance between an upper line and a dark shield layer can be effectively reduced. The vertical-type CMOS image sensor can include an inter-metal dielectric layer having a plurality of metal lines formed over a semiconductor substrate; a passivation oxide layer formed over the inter-metal dielectric layer, wherein the uppermost surface of the passivation oxide layer includes an inclined portion between a lower portion and an upper portion corresponding to a portion of the inter-metal dielectric layer having a plurality of the metal lines; a dark shield layer formed over the upper portion of the passivation oxide layer; and a nitride layer formed over the semiconductor substrate including the dark shield layer.
1. A method for manufacturing an image sensor comprising:
forming an inter-metal dielectric layer having a plurality of metal lines over a semiconductor substrate having a plurality of photodiodes;
forming a passivation oxide layer over the inter-metal dielectric layer;
forming a first photoresist pattern over a portion of the passivation oxide layer corresponding to the plurality of metal lines;
forming an inclined portion of the passivation oxide layer by a wet etching process using the first photoresist pattern;
forming a dark shield layer over a portion of the passivation oxide layer corresponding to the portion of the inter-metal dielectric layer having the plurality of metal lines and using the inclined portion of the passivation oxide layer as an alignment key; and then
forming a nitride layer over the semiconductor substrate including the dark shield layer.
2. The method of claim 1 , wherein forming the passivation oxide layer comprises:
depositing a passivation oxide layer having a low dielectric constant over the inter-metal dielectric layer; and
performing chemical mechanical polishing on the passivation oxide layer.
3. The method of claim 1 , wherein the passivation oxide layer is formed to a thickness sufficient to suppress parasitic capacitance between the dark shield layer and the plurality of metal lines.
4. The method of claim 3 , wherein the thickness of the passivation oxide layer is between 5,000 Å and 6,000 Å.
5. The method of claim 1 , wherein the dark shield layer comprises a double-layered structure.
6. The method of claim 1 , wherein the dark shield layer comprises a double-layered structure including a Ti layer and a TiN layer.
7. The method of claim 6 , wherein the Ti layer is formed over the passivation oxide layer by a PVD process using Ti as a target.
8. The method of claim 7 , wherein the PVD process comprises at least one of self-ionized plasma sputtering and hollow cathode magnetron sputtering.
9. The method of claim 7 , wherein the Ti layer has a thickness of at least 100 um.
10. The method of claim 6 , wherein the TiN layer is formed over the Ti by a PVD process using Ti as a target and then supplying nitrogen gas to a process chamber.
11. The method of claim 10 , wherein the PVD process comprises at least one of self-ionized plasma sputtering and hollow cathode magnetron sputtering.
12. The method of claim 11 , wherein the TiN layer has a thickness of about 300 um.
13. A method for manufacturing an image sensor comprising:
forming an inter-metal dielectric layer having a plurality of metal lines over a semiconductor substrate having a plurality of photodiodes;
forming a passivation oxide layer over the inter-metal dielectric layer, wherein an uppermost surface of the passivation oxide layer includes an inclined portion between a lower portion of the passivation oxide layer and an upper portion of the passivation oxide layer, wherein the upper portion of the passivation oxide layer corresponds to a portion of the inter-metal dielectric layer having a plurality of the metal lines;
forming a dark shield layer over the upper portion of the passivation oxide layer; and
forming a nitride layer over the dark shield layer.