Fabricating magnetic read heads with a reduced scratch exposure region
View Patent ↗Methods of fabricating magnetic read heads are provided which reduce the width of the scratch exposure region of a read head. During normal fabrication processes, a read head is formed with a first shield, a read element formed on the first shield, and hard bias layers formed on either side of the read element. The width of the read elements and the hard bias layers define an initial scratch exposure region. According to embodiments herein, a mask structure is formed to protect the read element and first portions of the hard bias layers proximate to the read element. A removal process is then performed to remove second portions of the hard bias layers that are not protected by the mask structure, which defines a final scratch exposure region that is smaller than the initial scratch exposure region.
1. A method of reducing the scratch exposure region of a read head, wherein the read head includes a first shield, a read element formed on the first shield, and hard bias layers formed on side regions of the read element, the method comprising:
forming a mask structure to protect the read element and first portions of the hard bias layers proximate to the read element;
performing a removal process to remove second portions of the hard bias layers that are not protected by the mask structure;
depositing insulating material;
removing the mask structure;
forming another mask structure to protect the read element, the first portions of the hard bias layers, and portions of the insulating material proximate to the hard bias layers;
depositing gap fill material; and
removing the other mask structure.
2. The method of claim 1 further comprising:
forming a second shield on the insulating material and the gap fill material.
3. The method of claim 1 wherein a thickness of the insulating material is at least 50 nm.
4. The method of claim 1 wherein the mask structure comprises a bi-layer mask structure.
5. The method of claim 1 wherein performing a removal process comprises:
performing a milling process to remove the second portions of the hard bias layers that are not protected by the mask structure.
6. A method of fabricating a read head, the method comprising:
fabricating a read element and hard bias layers on side regions of the read element, wherein the width of the read element and the hard bias layers define an initial scratch exposure region;
forming a mask structure on the read element and portions of the hard bias layers proximate to the read element;
performing a removal process to remove portions of the hard bias layers that are not protected by the mask structure, wherein the width of the read element and the remaining hard bias layers define a final scratch exposure region that is smaller than the initial scratch exposure region;
depositing insulating material;
removing the mask structure;
forming another mask structure on the read element, the remaining portions of the hard bias layers, and portions of the insulating material proximate to the hard bias layers;
depositing gap fill material; and
removing the other mask structure.
7. The method of claim 6 further comprising:
forming a second shield on the insulating material and the gap fill material.
8. The method of claim 6 wherein a thickness of the insulating material is at least 50 nm.
9. The method of claim 6 wherein the mask structure comprises a bi-layer mask structure.
10. The method of claim 6 wherein performing a removal process comprises:
performing a milling process to remove the portions of the hard bias layers that are not protected by the mask structure.
11. A method of fabricating a read head, the method comprising:
forming a stripe height and a track width of a read element of the recording head;
forming hard bias layers on side regions of the read element;
forming a mask structure that protects the read element and portions of the hard bias layers proximate to the read element;
removing portions of the hard bias layers exposed by the mask structure;
depositing insulating material;
removing the mask structure;
forming another mask structure on the read element, the remaining portions of the hard bias layers, and portions of the insulating material proximate to the hard bias layers;
depositing gap fill material; and
removing the other mask structure.
12. The method of claim 11 further comprising:
forming a second shield on the insulating material and the gap fill material.
13. The method of claim 11 wherein a thickness of the insulating material is at least 50 nm.
14. The method of claim 11 wherein the mask structure comprises a bi-layer mask structure.
15. The method of claim 11 wherein removing portions of the hard bias layers exposed by the mask structure comprises:
milling the portions of the hard bias layers exposed by the mask structure.