Resistance measurements of a helical coil

1. A method of testing resistances of helical coils formed in magnetic recording heads on a wafer, wherein the helical coils include a bottom coil structure, a top coil structure, and a plurality of connecting structures that electrically connect the bottom coil structure and the top coil structure to define a helical coil, the method comprising:

fabricating a test component on the wafer along with the magnetic recording heads, wherein the test component includes a bottom coil structure connected in series, and also includes a top coil structure connected in series which is electrically disconnected from the bottom coil structure;

measuring a resistance of the bottom coil structure in the test component;

measuring a resistance of the top coil structure in the test component;

measuring a total resistance of a helical coil that is fabricated on the wafer; and

determining the resistance of the connecting structures in the helical coil based on the resistance of the bottom coil structure, the resistance of the top coil structure, and the total resistance of the helical coil.

2. The method of claim 1 wherein fabricating a test component on the wafer along with the magnetic recording heads comprises:

forming the bottom coil structure in the test component, wherein the bottom coil structure comprises a plurality of bottom coil traces;

forming bottom connections between the bottom coil traces to connect the bottom coil traces in series;

depositing an insulation layer in the test component;

forming the top coil structure in the test component on the insulation layer, wherein the top coil structure comprises a plurality of top coil traces; and

forming top connections between the top coil traces to connect the top coil traces in series.

3. The method of claim 1 further comprising:

fabricating a plurality of test components that are staggered throughout the wafer.

4. The method of claim 1 wherein measuring a total resistance of a helical coil that is fabricated on the wafer comprises:

measuring the resistance of a helical coil that is fabricated in one of the magnetic recording heads on the wafer.

5. The method of claim 1 wherein measuring a total resistance of a helical coil that is fabricated on the wafer comprises:

measuring the resistance of a helical coil that is fabricated in another test component.

6. The method of claim 1 further comprising:

forming a coil structure in another test component, wherein the coil structure includes a plurality of traces that are substantially aligned longitudinally on a plane;

connecting first alternating traces to a first test pad;

connecting second alternating traces to a second test pad; and

measuring a resistance between the first test pad and the second test pad to determine if there is a short between two sequential traces.

7. The method of claim 2 wherein:

the bottom connections are formed in locations corresponding with locations for the connecting structures in a helical coil; and

the top connections are formed in locations corresponding with the locations for the connecting structures in a helical coil.

8. A method of testing resistances of helical coils formed in magnetic recording heads on a wafer, wherein the helical coils include a bottom coil structure, a top coil structure, and a plurality of connecting structures that electrically connect the bottom coil structure and the top coil structure to define a helical coil, the method comprising:

fabricating a test component on the wafer concurrently with the magnetic recording heads that include helical coils by:

forming a bottom coil structure in the test component, wherein the bottom coil structure comprises a plurality of bottom coil traces; and

forming bottom connections between the bottom coil traces to connect the bottom coil traces in series.

9. The method of claim 8 further comprising:

depositing an insulation layer in the test component;

forming a top coil structure in the test component on the insulation layer, wherein the top coil structure comprises a plurality of top coil traces; and

forming top connections between the top coil traces to connect the top coil traces in series.

10. The method of claim 9 further comprising:

measuring a resistance of the bottom coil structure in the test component;

measuring a resistance of the top coil structure in the test component;

measuring a total resistance of a helical coil that is fabricated on the wafer; and

determining the resistance of the connecting structures in the helical coil based on the resistance of the bottom coil structure, the resistance of the top coil structure, and the total resistance of the helical coil.

11. The method of claim 9 wherein:

the bottom connections are formed in locations corresponding with locations for the connecting structures in a helical coil; and

the top connections are formed in locations corresponding with the locations for the connecting structures in a helical coil.