IP Library Granted Patent US 8,270,125
Granted Patent B2
US 8,270,125 · App. 11/959,374 · Granted Sep 18, 2012

Tunnel junction magnetoresistive sensor having a near zero magnetostriction free layer

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Quick Facts
Patent No.
US 8,270,125
App. No.
11/959,374
Granted
Sep 18, 2012
Kind
B2
Abstract

A magnetoresistive tunnel junction sensor having improved free layer stability, as well as improved free sensitivity. The free layer is constructed to have a low magnetic coercivity which improves free layer sensitivity. The free layer is also constructed to have a negative magnetostriction which improves free layer stability by preventing the free layer from having an easy axis that is oriented perpendicular to the air bearing surface.

Claims (29)

1. A magnetoresistive sensor, comprising:

a magnetic pinned layer structure

a magnetic free layer structure;

a non-magnetic barrier layer sandwiched between the free layer structure and the pinned layer structure; and

a capping layer having a Face Centered Cubic (FCC) structure, the free layer structure being sandwiched between the non-magnetic barrier layer and the capping layer;

wherein the free layer structure further comprises:

a layer of CoFeB having a Body Centered Cubic (BCC) structure located directly adjacent to the non-magnetic barrier layer; and

an amorphous, magnetic buffer layer directly adjacent to the layer of CoFeB, opposite the non-magnetic barrier layer;

wherein the magnetoresistive sensor is subjected to a high temperature anneal, and wherein the amorphous buffer layer prevents the FCC grain structure of the capping layer from affecting the BCC structure of the CoFeB layer.

2. A magnetoresistive sensor as in claim 1 wherein the amorphous magnetic buffer layer comprises CoFeX, where X comprises one or more materials selected from the group consisting of Nb, Mo, Hf, Zr, Y, W, Si, Cr and Ti.

3. A magnetoresistive sensor as in claim 2 wherein the amorphous, magnetic buffer layer comprises at least 30 atomic percent X.

4. A magnetoresistive sensor as in claim 1 wherein the capping layer comprises one or more of Ta and Ru.

5. A magnetoresistive sensor as in claim 1 wherein the pinned layer structure includes a layer comprising CoFeB.

6. A magnetoresistive sensor as in claim 1 wherein the pinned layer structure further comprises:

a layer of CoFe;

a layer of CoFeB adjacent to the barrier layer; and

a non-magnetic antiparallel coupling layer sandwiched between the layer of CoFe and the layer of CoFeB.

7. A magnetoresistive sensor as in claim 6 wherein the layer of CoFeB in the pinned layer structure includes about 20 atomic percent B.

8. A magnetoresistive sensor as in claim 6 wherein the layer of CoFeB in the pinned layer structure includes about 20 atomic percent B and about 25 atomic percent Fe.

9. A magnetoresistive sensor as in claim 6 wherein the layer of CoFeB in the pinned layer structure is amorphous.

10. A magnetoresistive sensor, comprising:

a magnetic pinned layer structure

a magnetic free layer structure;

a non-magnetic barrier layer sandwiched between the free layer structure and the pinned layer structure; and

a capping layer having a Face Centered Cubic (FCC) structure, the free layer structure being sandwiched between the non-magnetic barrier layer and the capping layer;

wherein the free layer structure further comprises:

a layer of CoFeB having a Body Centered Cubic (BCC) structure located directly adjacent to the non-magnetic barrier layer; and

an amorphous, magnetic buffer layer directly adjacent to the layer of CoFeB, opposite the non-magnetic barrier layer;

wherein the magnetoresistive sensor is subjected to a high temperature anneal and wherein the amorphous buffer layer has a recrystallization temperature that is above that of the high temperature anneal, such that the FCC structure of the capping layer does not affect the BCC structure of the CoFeB layer.

Assignments (7)
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0821 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2008
From: GILL, HARDAYAL SINGH
To: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
Reel/Frame 020491/0523 →