THERMAL MANAGEMENT SYSTEMS AND METHODS
Thermal management systems and methods for electronics. A printed circuit board assembly may include a soldered-in heat sink in communication with inner layers of a printed circuit board for cooling. The heat sink may include a plurality of leads received by plated through-holes in the printed circuit board. The heat sink may include features to augment surface area, as well as features to increase turbulence in a supplied cooling medium for enhanced convection. The heat sink may also include a heat pipe to facilitate cooling. The number, placement and configuration of the heat sinks may be optimized for a particular application to make efficient use of available surface area on the printed circuit board.
1 . A printed circuit board assembly, comprising:
a first electronic substrate having a first surface;
at least one electronic component mounted on the first surface of the first electronic substrate; and
a heat sink mounted on the first surface of the first electronic substrate adjacent to the at least one electronic component.
2 . The assembly of claim 1 , wherein the heat sink comprises a material with a thermal conductivity of at least about 300 W/mK at 300 K.
3 . The assembly of claim 2 , wherein the heat sink comprises copper.
4 . The assembly of claim 1 , wherein the heat sink comprises a sheet metal.
5 . The assembly of claim 1 , further comprising a source of a cooling medium in fluid communication with the heat sink.
6 . The assembly of claim 5 , wherein the heat sink comprises a feature configured to enhance turbulence in the cooling medium.
7 . The assembly of claim 6 , wherein the feature comprises at least one relief defined by a surface of the heat sink.
8 . The assembly of claim 1 , wherein the heat sink comprises a lead received by an aperture formed in the first electronic substrate.
9 . The assembly of claim 8 , wherein the lead is in contact with a ground plane of the first electronic substrate.
10 . The assembly of claim 1 , wherein the heat sink comprises a plurality of leads, and wherein the first electronic substrate defines a plurality of apertures each adapted to receive a lead.
11 . The assembly of claim 1 , further comprising a second heat sink mounted on the first surface of the first electronic substrate adjacent to the at least one electronic component.
12 . The assembly of claim 1 , further comprising a second electronic substrate in electrical communication with the first electronic substrate.
13 . The assembly of claim 1 , wherein the heat sink is spaced from the at least one electronic component.
14 . The assembly of claim 1 , further comprising a heat pipe constructed and arranged to convey heat from the heat sink away from the printed circuit board assembly.
15 . The assembly of claim 1 , wherein the heat sink is pitched relative to the first surface of the first electronic substrate.
16 . The assembly of claim 15 , wherein the heat sink is oriented substantially perpendicular relative to the first surface of the first electronic substrate.
17 . The assembly of claim 1 , wherein the heat sink is constructed and arranged to increase an effective surface area of the heat sink.
18 . The assembly of claim 17 , wherein the heat sink comprises at least one fin or fold.
19 . The assembly of claim 1 , wherein the heat sink is positioned between two electronic components.
20 . A method of facilitating thermal management, comprising:
positioning a heat sink on a surface of an electronic substrate adjacent to an electronic component mounted on the substrate; and
establishing thermal communication between the heat sink and an inner plane of the electronic substrate.
21 . The method of claim 20 , further comprising directing a cooling medium toward the heat sink.
22 . The method of claim 21 , further comprising conveying heat away from the heat sink with a heat pipe.
23 . The method of claim 20 , further comprising securing the heat sink to the electronic substrate so that the heat sink engages a ground plane of the electronic substrate.
24 . A printed circuit board assembly, comprising:
an electronic substrate having a first surface and an inner plane;
an electronic component mounted on the first surface of the electronic substrate; and
a heat sink, mounted on the first surface of the electronic substrate adjacent to the electronic component, and in thermal communication with the inner plane of the electronic substrate.
25 . The assembly of claim 24 , wherein the heat sink comprises a lead received by a through-hole defined by the electronic substrate, and wherein the lead is in thermal communication with the inner plane of the electronic substrate.