IP Library Granted Patent US 7,842,146
Granted Patent B2
US 7,842,146 · App. 11/961,114 · Granted Nov 30, 2010

Ultrasonic energy for adhesive bonding

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Quick Facts
Patent No.
US 7,842,146
App. No.
11/961,114
Granted
Nov 30, 2010
Kind
B2
Abstract

An adhesive is contacted with a surface of a substrate and ultrasonic energy is applied to the adhesive to enhance the bonding of the adhesive to the surface of the substrate. The ultrasonic energy, particularly ultrasonic vibrations, can assist the adhesive in wetting the substrate surface, curing, polymerization or the like to enhance bonding.

Claims (35)

1. A method of bonding an adhesive to a surface of an article of manufacture during formation of the article, the method comprising:

contacting, during the formation of the article of manufacture, an adhesive with a surface of a first substrate, wherein:

i. the adhesive is a latent adhesive and includes a plurality of encapsulations which are dispersed throughout the adhesive, wherein the plurality of encapsulations encapsulate a curing agent or other reactive compound;

ii. the adhesive includes at least one of an epoxy, a polyurethane, a polyurea, a polyester, a vinyl ester, or a silyl terminated polymer type adhesive, or a phenolic; and

iii. the article of manufacture is furniture, a transportation vehicle, a household appliance, a toy or an electronic device; and

applying ultrasonic energy at a frequency of about 10 to about 50 KHz to the first substrate to assist in rupturing the plurality of the encapsulations, thus releasing the curing agent or other reactive compound and bonding the adhesive to the surface of the first substrate without the use of added heat to an environment surrounding the adhesive, wherein the ultrasonic energy is used to provide a first degree of bonding and the adhesive undergoes a second degree of bonding at a later time.

2. A method as in claim 1 further comprising contacting the adhesive with a surface of a second substrate wherein the application of ultrasonic energy to the adhesive assists in bonding the adhesive to the surface of the second substrate.

3. A method as in claim 2 wherein the first substrate is part of a structure of an automotive vehicle and the second structure is part of an automotive vehicle.

4. A method as in claim 1 wherein the adhesive is a heat and/or latent curable adhesive that is selected from an epoxy type adhesive, a polyurethane type adhesive, a polyurea type adhesive or a silyl terminated polymer type adhesive.

5. A method as in claim 1 wherein the ultrasonic energy is provided as ultrasonic vibrations.

6. A method as in claim 1 wherein the surface of the first substrate and the surface of the second substrate are contoured.

7. A method of bonding an adhesive to a surface of an article of manufacture during formation of the article, the method comprising:

contacting, during the formation of the article of manufacture, an adhesive with a surface of a first substrate, wherein:

iv. the adhesive is a latent adhesive and includes a plurality of encapsulations which are dispersed throughout the adhesive, wherein the plurality of encapsulations encapsulate a curing agent or other reactive compound;

v. the adhesive includes at least one of an epoxy, a polyurethane, a polyurea, a polyester, a vinyl ester or a phenolic; and

vi. the article of manufacture is furniture, a transportation vehicle, a household appliance, a toy or an electronic device; and

applying ultrasonic energy at a frequency of about 10 to about 50 KHz to the first substrate to assist in rupturing the plurality of the encapsulations, thus releasing the curing agent or other reactive compound and bonding the adhesive to the surface of the first substrate without the use of added heat to an environment surrounding the adhesive; wherein the ultrasonic energy is applied intermittently and repetitively.

8. A method as in claim 1 wherein the ultrasonic energy is employed to cure only one or more portions of the adhesive.

9. A method as in claim 1 further comprising:

contacting, also during the formation of the article of manufacture, the adhesive with a surface of a second substrate wherein

the article of manufacture is an automotive vehicle and the first substrate or the second substrate are members of the automotive vehicle.

10. A method as in claim 9 wherein the adhesive is selected from an epoxy type adhesive, a polyurethane type adhesive, a polyurea type adhesive or a silyl terminated polymer type adhesive.

11. A method as in claim 9 wherein the ultrasonic energy is provided as ultrasonic vibrations.

12. A method as in claim 9 wherein the surface of the first substrate and the surface of the second substrate are contoured.

13. A method as in claim 9 wherein the ultrasonic energy is used to provide a first degree of bonding and the adhesive undergoes a second degree of bonding at a later time.

14. A method as in claim 9 wherein the ultrasonic energy is applied intermittently and repetitively.

15. A method as in claim 9 wherein the ultrasonic energy is employed to cure only one or more portions of the adhesive.

16. A method of bonding an adhesive to a surface of an article of manufacture during formation of the article, the method comprising:

contacting, during the formation of the article of manufacture, an adhesive with a surface of a first substrate, wherein:

vii. the adhesive is a latent adhesive and includes a plurality of encapsulations which are dispersed throughout the adhesive, wherein the plurality of encapsulations encapsulate a curing agent or other reactive compound;

viii. the adhesive includes at least one of an epoxy, a polyurethane, a polyurea, a polyester, a vinyl ester or a phenolic; and

ix. the article of manufacture is furniture, a transportation vehicle, a household appliance, a toy or an electronic device; and

applying ultrasonic energy at a frequency of about 10 to about 50 KHz to the first substrate to assist in rupturing the plurality of the encapsulations, thus releasing the curing agent or other reactive compound and bonding the adhesive to the surface of the first substrate without the use of added heat to an environment surrounding the adhesive; wherein different levels of ultrasonic energy are applied progressively.

17. A method according to claim 1 wherein the ultrasonic energy is applied when the article of manufacture is in an environment of below 35° C.

18. A method according to claim 9 wherein different levels of ultrasonic energy are applied progressively.

Assignments (2)
CHANGE OF NAME Recorded Oct 24, 2017
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 044580/0975 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2010
From: SIAVOSHANI, SAEED; MAHDI, SYED Z.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 025180/0298 →