IP Library Granted Patent US 7,597,484
Granted Patent B2
US 7,597,484 · App. 11/961,227 · Granted Oct 6, 2009

MID module and a method of mounting an optical fibre in an MID module

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Quick Facts
Patent No.
US 7,597,484
App. No.
11/961,227
Granted
Oct 6, 2009
Kind
B2
Abstract

An MID module with a plug-type connector for an optical fibre with an upper face, edge faces and a lower face, comprising an accommodating channel surrounded by walls for the accommodation of an optical fibre. Here the diameter of the accommodation channel essentially corresponds to that of the optical fibre. The MID module further comprises a semiconductor chip, which is arranged on a front face of the accommodating channel. The semiconductor chip comprises an optically active region, which is optically accessible from the accommodation channel. A slot is provided in the walls of the MID module for the accommodation of a locking element. A locking element, introducible into the slot, locks the fibre in the accommodating channel.

Claims (17)

1. A moulded interconnect device (MID) kit, comprising:

a MID module, comprising:

a module body having an upper face, edge faces, a lower face, and an accommodating channel surrounded by walls for accommodating an optical fibre, the accommodating channel having a diameter corresponding to a diameter of the optical fibre, the module body further having a slot in the walls for accommodating an element to be retained in the slot, wherein the slot forms an angle, α, with the front face of the MID module, wherein α>90°; and

a semiconductor chip arranged on a front face of the accommodating channel, the semiconductor chip comprising an optically active region that is optically accessible from the accommodating channel;

a locking element separate from the MID module and introducible into the slot and having an opening provided therein for accommodating the fibre, wherein the locking element locks the fibre in the accommodating channel and obliquely engages the slot to urge the optical fibre toward the front face of the accommodating channel.

2. The MID kit of claim 1 , wherein the locking element comprises two arms that surround the opening provided in the locking element for accommodating the fibre.

3. The MID kit according to claim 2 , wherein each of the arms has an inner face, the inner faces of the arms facing towards the opening and having cutting edges formed thereon that dig into the fibre.

4. The MID kit according to claim 3 , wherein the locking element includes a clamp that forms an angle α with the arms, and wherein in an installed state of the locking element, the clamp is aligned to and in parallel with the upper face of the MID module.

5. The MID kit according to 4 , wherein the arms of the locking element include engaging hooks, and wherein during installation of the locking element, the hooks engage between the fibre and a floor of the accommodating channel.

6. The MID kit according to claim 5 , wherein the engaging hooks comprise cutting edges that dig into the fibre.

7. The MID kit according to claim 1 , wherein the locking element includes external hooks and wherein the walls of the accommodating channel includes stops, the external hooks acting together with the stops in the walls of the accommodating channel to lock the locking element in the slot formed in the walls of the accommodating channel.

8. The MID kit according to claim 1 , wherein the locking element is embodied in plastic.

9. The MID kit according to claim 1 , wherein the locking element is embodied in metal.

10. The MID kit according to claim 9 , wherein the locking element includes a metal cap, and wherein in an installed state of the locking element, the metal cap covers the upper face and the edge faces of the MID module.

11. A method for the installing an optical fibre using a moulded interconnect device (MID) module, the MID module having an upper face, edge faces and a lower face, the method comprising:

introducing a fibre into an accommodating channel surrounded by walls for accommodating the fibre, the accommodating channel having a diameter corresponding to a diameter of the fibre, wherein a semiconductor chip is arranged on a front face of the accommodating channel, the semiconductor chip comprising an optically active region that is optically accessible from the accommodating channel, wherein the walls have a slot formed therein at an angle, α, with the front face of the accommodating channel, wherein α>90°, and wherein the fibre is introduced into the accommodating channel from an entry face of the MID module lying opposite to the front face of the accommodating channel; and

introducing a locking element into a slot in the walls surrounding the accommodating channel and locking the locking element in the slot while clamping an outer surface of the fibre in an opening formed in the locking element, wherein the locking element locks the fibre in the accommodating channel and obliquely engages the slot to urge the optical fibre toward the front face of the accommodating channel.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER PREVIOUSLY RECORDED AT REEL: 047195 FRAME: 0827. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Nov 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047924/0571 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047195/0827 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0672 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2008
From: GHAHREMANI, CYRUS; PAULUS, STEFAN; BETZ, BERND; DANGELMAIER, JOCHEN; LEHNER, RUDOLF S.
To: AVAGO TECHNOLOGIES FIBER IP PTE. LTD.
Reel/Frame 020587/0236 →