Method for preparing a moisture curable hot melt adhesive

1. A method of forming a moisture curable hot melt adhesive comprising:

forming an isocyanate terminated prepolymer by reacting at least one of 4,4′ methylene bisphenyl diisocyanate (MDI), hydrogenated 4,4′ methylene bisphenyl diisocyanate (MDI) and hexamethylene diisocyanate with at least one polyol, wherein the polyol is not a polyhydroxy ester of alkyl fatty acids or an ethylene oxide adduct of a polyol, and

(ii) chain extending said prepolymer by reaction with a chain extender including at least one of ethylene glycol, 1,4-butane diol, 1,6-hexane diol, 1,4-bis(hydroxymethyl)cyclohexane, p-di(2-hydroxyethoxy)benzene, m-di(2-hydroxyethoxy)benzene (HER), trimethylolpropane (TMP) and 2,4-diamino-3,5-diethyltoluene to form an isocyanate terminated moisture curable hot melt adhesive.

2. The method of claim 1 wherein said prepolymer is formed by reacting excess diisocyanate with the polyol.

3. The method of claim 1 , wherein step (i) comprises:

(i) forming a mixture comprising 4,4′ methylene bisphenyl diisocyanate (MDI) and the isocyanate terminated prepolymer.

4. The method of claim 1 wherein the chain extender is selected from p-di(2-hydroxyethoxy)benzene, m-di(2-hydroxyethoxy)benzene (HER) or a mixture thereof.

5. The method of claim 1 wherein the chain extender is 2,4-diamino-3,5-diethyltoluene.

6. A moisture curable hot melt adhesive prepared by the method of claim 1 .

7. A method of bonding materials together which comprises providing the moisture curable hot melt adhesive of claim 6 in solid form; heating the moisture curable hot melt adhesive to a liquid or fluid state; applying the heated moisture reactive hot melt adhesive to a first substrate, bringing a second substrate in contact with the moisture curable hot melt adhesive applied to the first substrate, subjecting the substrates and applied moisture curable hot melt adhesive to conditions which will allow the moisture curable hot melt adhesive to cool to room temperature and solidify; subjecting the solidified moisture curable hot melt adhesive to moisture to cure the hot melt adhesive to an irreversible solid form.

8. A process for manufacturing an article, comprising applying the adhesive of claim 6 to a substrate surface and bringing a second substrate surface in contact with said first substrate surface.

9. An article of manufacture comprising the adhesive of claim 6 which has been cooled to a solid state at room temperature but is not cured.

10. The method of claim 1 wherein the polyol further comprises a polyether polyol.

11. The method of claim 1 wherein the polyol comprises a mixture of crystalline polyester polyol and polyether polyol.

12. A method of forming a moisture curable hot melt adhesive comprising:

forming an isocyanate terminated prepolymer by reacting an excess of 4,4′ methylene bisphenyl diisocyanate (MDI), hydrogenated 4,4′ methylene bisphenyl diisocyanate (MDI) and hexamethylene diisocyanate with a mixture of polyether polyol and non-polyether polyol, and

chain extending the prepolymer by reaction with a chain extender including at least one of ethylene glycol, 1,4-butane diol, 1,6-hexane diol, 1,4-bis(hydroxymethyl)cyclohexane, p-di(2-hydroxyethoxy)benzene, m-di(2-hydroxyethoxy)benzene (HER), trimethylolpropane (TMP) and 2,4-diamino-3,5-diethyltoluene to the isocyanate terminated prepolymer to form the moisture curable hot melt adhesive.

13. The method of claim 1 wherein the at least one polyol comprises crystalline polyester polyol.

14. A moisture curable hot melt adhesive comprising the isocyanate terminated prepolymer of claim 1 .

15. An article of manufacture comprising cured reaction products of the adhesive of claim 1 .