IP Library Granted Patent US 8,136,920
Granted Patent B2
US 8,136,920 · App. 11/962,912 · Granted Mar 20, 2012

Nozzle plate, method for manufacturing nozzle plate, droplet discharge head, and droplet discharge apparatus

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Quick Facts
Patent No.
US 8,136,920
App. No.
11/962,912
Granted
Mar 20, 2012
Kind
B2
Abstract

A nozzle plate includes: a first silicon layer; a glass layer; a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and a silicon oxide layer provided between the first silicon layer and the second silicon layer. A nozzle hole passing through the first silicon layer and discharging a droplet is formed. A channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole is formed. A liquid chamber formed in the glass layer and communicating with the channel is formed.

Claims (74)

1. A nozzle plate comprising:

a first silicon layer;

a glass layer;

a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and

a silicon oxide layer provided between the first silicon layer and the second silicon layer,

a nozzle hole passing through the first silicon layer and discharging a droplet being formed,

a channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole being formed,

a liquid chamber formed in the glass layer and communicating with the channel being formed, and

a liquid chamber layer provided in contact with the glass layer on a side thereof opposite to the second silicon layer and formed from a material different from that of the glass layer,

wherein the liquid chamber extends in the liquid chamber layer.

2. The nozzle plate according to claim 1 , wherein

opening diameter of the channel is larger than opening diameter of the nozzle hole, and

opening diameter of the liquid chamber is larger than the opening diameter of the channel.

3. The nozzle plate according to claim 1 , wherein a cover film is formed on an inner wall of the nozzle hole, and the cover film is made of a material having a higher affinity for liquid discharged from the nozzle hole than silicon.

4. The nozzle plate according to claim 3 , wherein the cover film is made of oxide silicon.

5. The nozzle plate according to claim 3 , wherein a water-repellent layer is formed on an outer surface of the first silicon layer, and the water-repellent layer is made of a material having a lower affinity for liquid discharged from the nozzle hole than the cover film.

6. The nozzle plate according to claim 1 , wherein outlet-side opening diameter of the nozzle hole is equal to or less than inlet-side opening diameter of the nozzle hole.

7. The nozzle plate according to claim 1 , wherein the bonding is anodic bonding.

8. The nozzle plate according to claim 1 , wherein the channel has an opening shape which converges toward the nozzle hole.

9. A nozzle plate comprising:

a first silicon layer;

a glass layer;

a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and

a silicon oxide layer provided between the first silicon layer and the second silicon layer,

a nozzle hole passing through the first silicon layer and discharging a droplet being formed

a channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole being formed,

a liquid chamber formed in the glass layer and communicating with the channel being formed, and

a liquid chamber layer bonded to the glass layer on a side thereof opposite to the second silicon layer and formed from a material different from that of the glass layer,

the liquid chamber extending in the liquid chamber layer,

wherein a cover layer is formed on a wall of the liquid chamber layer, the wall facing to the liquid chamber, and the cover layer is made of a material different from that of the liquid chamber layer.

10. A method for manufacturing a nozzle plate, comprising:

in a laminated body including a first silicon layer, a second silicon layer, and a silicon oxide layer provided between the first silicon layer and the second silicon layer, forming a nozzle hole passing through the first silicon layer;

forming a channel passing through the second silicon layer;

removing the silicon oxide layer exposed to bottom of the channel so that the nozzle hole communicates with the channel; and

anodic bonding the second silicon layer to a glass layer having a liquid chamber so that the channel communicates with the liquid chamber; and

wherein a plurality of the nozzle holes are formed, and adjacent nozzle holes are partitioned with the glass layer.

11. The method for manufacturing a nozzle plate according to claim 10 , wherein silicon oxide is formed on an inner wall of the nozzle hole.

12. A droplet discharge head comprising:

a nozzle plate; and

pressurizing means for applying pressure to liquid in the liquid chamber,

the nozzle plate including:

a first silicon layer;

a glass layer;

a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and

a silicon oxide layer provided between the first silicon layer and the second silicon layer,

a nozzle hole passing through the first silicon layer and discharging a droplet being formed,

a channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole being formed, and

a liquid chamber formed in the glass layer and communicating with the channel being formed, and

a plurality of the nozzle holes are provided, and adjacent nozzle holes are partitioned with the glass layer.

13. A droplet discharge apparatus comprising:

a droplet discharge head;

a driver for relatively moving an object and the droplet discharge head; and

a controller for controlling the droplet discharge head and the driver,

the droplet discharge head including:

a nozzle plate; and

pressurizing means for applying pressure to liquid in the liquid chamber,

the nozzle plate including:

a first silicon layer;

a glass layer;

a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and

a silicon oxide layer provided between the first silicon layer and the second silicon layer,

a nozzle hole passing through the first silicon layer and discharging a droplet being formed,

a channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole being formed,

a liquid chamber formed in the glass layer and communicating with the channel being formed, and

a plurality of the nozzle holes are provided, and adjacent nozzle holes are partitioned with the glass layer.

14. A nozzle plate comprising:

a first silicon layer;

a glass layer;

a second silicon layer provided between the first silicon layer and the glass layer, the second silicon layer being bonded to the glass layer; and

a silicon oxide layer provided between the first silicon layer and the second silicon layer,

a nozzle hole passing through the first silicon layer and discharging a droplet being formed

a channel passing through the silicon oxide layer and the second silicon layer and communicating with the nozzle hole being formed,

a liquid chamber formed in the glass layer and communicating with the channel being formed, and

wherein a plurality of the nozzle holes are provided, and adjacent nozzle holes are partitioned with the glass layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA TEC KABUSHIKI KAISHA
Reel/Frame 047381/0532 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2008
From: SAKURAI, NAOAKI; YAMABE, JUNSEI; KOIZUMI, HIROSHI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 020981/0783 →