Apparatus for manipulating droplets
An apparatus for manipulating droplets is provided. In one embodiment, the apparatus includes a substrate having a set of electrical leads for connecting electrodes to a controller, a first set of electrodes, each connected to a separate one of the electrical leads, and a second set of electrodes, all connected to a single one of the electrical leads. In another embodiment, the apparatus includes a substrate having a set of X electrodes, and a set of Y electrical leads, each connected to one or more electrodes, wherein X is greater than Y.
1. An apparatus for manipulating droplets, the apparatus comprising a substrate comprising:
(a) a set of electrical leads for connecting electrodes to a controller;
(b) an electrode array comprising:
(i) a first set of electrodes, each connected to a separate one of the electrical leads; and
(ii) a second set of electrodes, all connected to a single one of the electrical leads;
(iii) an insulation layer applied to the first and second sets of electrodes; and
(c) a conductive grid superimposed on the electrode array and set at a ground or reference potential.
2. The apparatus of claim 1 wherein the second set of electrodes comprises a column of electrodes all connected to a single one of the electrical leads.
3. The apparatus of claim 1 wherein the first and second set of electrodes are arranged in a two dimensional array of electrodes.