IP Library Granted Patent US 7,438,390
Granted Patent B2
US 7,438,390 · App. 11/965,696 · Granted Oct 21, 2008

Printhead module assembly with A flexible PCB

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Quick Facts
Patent No.
US 7,438,390
App. No.
11/965,696
Granted
Oct 21, 2008
Kind
B2
Abstract

The invention relates to a printhead module assembly for a pagewidth printer system. The module assembly includes a printhead integrated circuit (IC) manufactured using a micro-electromechanical systems (MEMS) process, and a flexible printed circuit board electrically connected to the integrated circuit for supplying power and data thereto. The module assembly also includes a top channel layer supporting the IC, the top channel layer defining a number of slots therein, and an upper layer defining holes that are aligned with inner parts of the slots of the top channel layer, the upper layer further defining a number of channels. Further included is a mid layer defining a number of holes which are aligned with ends of the channel in the upper layer. A lower layer defines channels for supplying ink and compressed air to the IC via the layers such layers stacked to form an ink distribution assembly.

Claims (13)

1. A printhead module assembly for a pagewidth printer system, the module assembly comprising:

a printhead integrated circuit (IC) manufactured using a micro-electromechanical systems (MEMS) process;

a flexible printed circuit board (PCB) electrically connected to the integrated circuit for supplying power and data thereto;

a top channel layer supporting the IC, the top channel layer defining a number of slots therein;

an upper layer defining holes that are aligned with respective inner parts of the slots of the top channel layer, the upper layer further defining a number of channels;

a mid layer defining a number of holes which are aligned with respective ends of the channels in the upper layer; and

a lower layer defining channels for supplying ink and compressed air to the IC via the layers stacked to form an ink distribution assembly.

2. The module assembly of claim 1 , wherein the IC is bonded by wires onto the flexible PCB, the wires being encapsulated in an epoxy.

3. The module assembly of claim 1 , wherein the IC includes a multi-layer stack of silicon having ink channels in a bottom layer of silicon, the channels being aligned with the channels in the upper layer.

4. The module assembly of claim 1 , wherein the channels defined in the upper and lower layers are configured to each supply a different color ink to the IC, with one channel configured to supply compressed air to the IC.

5. The module assembly of claim 4 , which includes a nozzle guard which covers nozzles of the IC, the nozzle guard arranged in fluid communication with a compressed air source to supply compressed air to such nozzles.

6. The module assembly of claim 5 , including a compressed air supply for supplying air to the nozzle guard.

7. The module assembly of claim 1 , wherein the IC is approximately 1 mm in width and 21 mm in length.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028569/0628 →