Clamp for electrical devices

1. An assembly for clamping electrical components against a heat-dissipating surface of a heat sink, the assembly comprising:

a heat sink comprising a heat-dissipating surface;

a plurality of electrical components comprising a first electrical component a second electrical component, a third electrical component, and a fourth electrical component;

a plurality of resilient members comprising a first resilient member and

a second resilient member, where:

each of the first resilient member and the second resilient member comprises a first surface and a second surface opposite the first surface;

the second surface of each of the first resilient member and the second resilient member comprises a contact region, a second contact region, and an attachment region located between the first contact region and the second contact region;

the second surface of the first resilient member positioned to overlap the first surface of the second resilient member;

the first contact region of the second surface of the first resilient member positioned to hold the first electronic component against the heat-dissipating surface;

the first contact region of the second surface of the second resilient member positioned to hold the second electronic component against the heat-dissipating surface;

the second contact region of the second surface of the second resilient member positioned to hold the third electronic component against the heat-dissipating surface; and

the second contact region of the second surface of the first resilient member positioned to hold the fourth electronic component against the heat-dissipating surface; and

a single fastener, the single fastener operable to couple the resilient members to the heat sink in the attachment region of each of the first resilient member and the second resilient member.

2. The assembly of claim 1 , where the second surface of each of the first resilient member and the second resilient member has a concave shape facing the heat-dissipating surface.

3. The assembly of claim 2 , where each of the first contact region and the second contact region of the second surface of the first resilient member and the second resilient member has a convex shape facing the heat-dissipating surface.

4. The assembly of claim 1 , where the electrical components are arranged on the heat-dissipating surface along a single axis to position the first electrical component adjacent the second electrical component, and the third electrical component adjacent the fourth electrical component.

5. The assembly of claim 1 , where the single fastener is operable to couple the resilient members to the heat sink through a gap between the second electrical component and the third electrical component.

6. The assembly of claim 1 , where the first resilient member is symmetric about the attachment region of the second surface of the first resilient member and the second resilient member is symmetric about the attachment region of the second surface of the second resilient member.

7. The assembly of claim 1 , further comprising a spacer interposed between the resilient members and the heat sink.

8. The assembly of claim 1 , where distal ends of each of the resilient members are rounded.

9. The assembly of claim 1 , further comprising a circuit board interposed between the heat-dissipating surface and the electrical components.

10. The assembly of claim 1 , where the second resilient member further comprises an alignment leg projecting in a direction substantially perpendicular to the second surface of the second resilient member.

11. The assembly of claim 10 , further comprising a circuit board interposed between the heat-dissipating surface and the electrical components, the circuit board comprising a slot, where the alignment leg is positioned to fit into the slot and to align the second resilient member with respect to the circuit board.

12. A heat sink clamp for holding semiconductor devices against a mounting surface of a heat sink, the heat sink clamp comprising:

a plurality of springs, each of the springs including:

a first length along a first axis;

a second length along a second axis perpendicular to the first axis, the

second length shorter than the first length;

a first contact point and a second contact point positioned on the first axis of each of the springs; and

an attachment point positioned between the first contact point and the second contact point, where each one of the first contact point and the second contact point of each of the springs is positioned to hold a respective one of the semiconductor devices in thermal contact with the mounting surface; and

a single fastener assembly, where the single fastener assembly is operable to couple the springs together at the attachment point of each of the springs,and the springs overlap and are contiguous at the attachment point.

13. The heat sink clamp of claim 12 , where the springs further comprise a first spring and a second spring, where the first length of the first spring is greater than the first length of the second spring, and where the first spring is positioned farther from the mounting surface than the second spring.

14. The heat sink clamp of claim 12 , where the fastener assembly comprises only one fastener, the first axis of each of the springs lies in a single plane, and the single plane is substantially perpendicular to the mounting surface.

15. The heat sink clamp of claim 14 , where the fastener assembly includes a cross-sectional axis perpendicular to the single plane, and the fastener includes a cross-sectional length along the cross-sectional axis, where the cross-sectional length and the second length of each of the springs is less than or equal to a semiconductor device length, as measured in a direction of the cross-sectional axis, of one or more semiconductor devices held by the springs in thermal contact with the mounting surface.

16. The heat sink clamp of claim 12 , where:

the fastener assembly further comprises a spacer having a cross-sectional shape;

each of the springs further comprises an aperture located at the attachment point, the aperture formed with a predetermined shape;

the predetermined shape of the aperture of the first spring is formed to substantially match the cross-sectional shape of the spacer, the spacer fit into the aperture of the first spring and affixed to the first spring; and

the predetermined shape of the aperture of all of the springs except the first spring formed to permit the spacer to pass through the aperture of all of the springs except the first spring, without the spacer being affixed to all of the springs except the first spring.

17. The heat sink clamp of claim 12 , where each of the springs further comprises rounded ends located along the first axis of each of the springs.

18. A method of clamping a plurality of electrical components against a heat sink surface, the clamping method comprising:

positioning a plurality of electrical components in thermal contact with a heat sink surface, each of the electrical components comprising a first side and a second side opposite the first side, where the second side of each of the electrical components faces the heat sink surface;

providing a clamp comprising a plurality of springs;

placing a first contact end of each respective one of the springs in contact with the first side of a respective one of the electrical components;

placing a second contact end of each respective one of the springs in contact with the first side of another respective one of the electrical components;

positioning the springs to overlap at a fastening point of each of the springs, the fastening point of each of the springs between the first contact end and the second contact end of the respective one of the springs;

coupling the springs together at the fastening point with a fastener; and

moving the fastener toward the heat sink surface causing:

the springs to deform;

the first contact end of each respective one of the springs to clamp, against the heat sink surface, the respective one of the electrical components in contact with the first contact end of each respective one of the springs; and

the second contact end of each respective one of the springs to clamp, against the heat sink surface, the another respective one of the electrical components in contact with the second contact end of each respective one of the springs.

19. The method of claim 18 , further comprising:

securing the springs to the heat sink surface with the fastener, where the fastener is a single fastener.

20. The method of claim 18 , where:

positioning the electrical components includes arranging the electrical components along a single axis; and

providing a clamp includes aligning the springs in a direction defined by the single axis, and stacking the springs in a stacking plane, where the stacking plane contains the single axis and is perpendicular to the heat sink surface.

21. The method of claim 18 , further comprising an initial step of sizing the springs to ensure that a width of the springs measured in a direction perpendicular to the stacking plane is equal to or less than a width of the electrical components measured in the direction perpendicular to the stacking plane.

22. The method of claim 18 , where the step of coupling the springs together at the fastening point of each of the springs with the fastener further comprises press-fitting the fastener to at least one of the springs.

23. The method of claim 18 , where:

positioning the electrical components includes arranging the electrical components along a single axis; and

providing a clamp includes aligning the springs in a direction defined by the single axis, stacking the springs in a stacking plane, one of the springs completely covering any one of the springs that is closer to the heat sink surface, and where the stacking plane contains the single axis and is perpendicular to the heat sink surface.