IP Library Granted Patent US 7,755,941
Granted Patent B2
US 7,755,941 · App. 11/971,334 · Granted Jul 13, 2010

Nonvolatile semiconductor memory device

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Quick Facts
Patent No.
US 7,755,941
App. No.
11/971,334
Granted
Jul 13, 2010
Kind
B2
Abstract

In a nonvolatile semiconductor memory device storing data by accumulating charges in a floating gate, memory units, each of which includes a first MOS transistor as a read device, a bit cell composed of a first capacitor as a capacitance coupling device and a second capacitor as an erase device, and a decode device including a second MOS transistor and a third MOS transistor, are arranged in array. This attains nonvolatile memory capable of bit by bit selective erase arranged in array to thus reduce the core area remarkably.

Claims (14)

1. A nonvolatile semiconductor memory device comprising a plurality of memory units arranged in array and each including a read device, an erase device, and a decode device, each of which is composed of a MOS transistor,

wherein in each of the memory units, the read device and the erase device are connected to each other, the read device and the erase device share a gate, and an output side of the decode device, which is controlled by a row selection signal and a column selection signal, is connected to the erase device.

2. The nonvolatile semiconductor memory device of claim 1 ,

wherein the column selection signal of the decode device is generated from a program signal and a data signal.

3. The nonvolatile semiconductor memory device of claim 1 ,

wherein the column selection signal of the decode device is generated from an address signal, a data signal and a program signal.

4. The nonvolatile semiconductor memory device of claim 1 ,

wherein the decode device is composed of a NAND circuit.

5. The nonvolatile semiconductor memory device of claim 1 ,

wherein a part under a drain of at least one MOS transistor of the decode device is subjected to well injection.

6. The nonvolatile semiconductor memory device of claim 1 , further comprising:

a capacitance coupling device connected to the gate shared by read device and the erase device in each of the memory units.

7. The nonvolatile semiconductor memory device of claim 1 ,

wherein a thickness of a gate oxide film of each MOS transistor composing the respective memory units is substantially equal to a thickness of a gate oxide film of a MOS transistor forming an input/output circuit of an LSI.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →
CHANGE OF NAME Recorded Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2008
From: YAMAMOTO, YASUE; SHIRAHAMA, MASANORI; AGATA, YASUHIRO; KAWASAKI, TOSHIAKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 020959/0413 →