IP Library Granted Patent US 7,833,464
Granted Patent B2
US 7,833,464 · App. 11/971,657 · Granted Nov 16, 2010

Imprinting apparatus and imprinting method

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Quick Facts
Patent No.
US 7,833,464
App. No.
11/971,657
Granted
Nov 16, 2010
Kind
B2
Abstract

An imprinting apparatus and an imprinting method that prevents movement of an imprinting mold during an imprinting process. The imprinting method includes coating a resin on a substrate; aligning an imprinting mold on the resin; temporarily securing the imprinting mold on the substrate; pressing the imprinting mold; hardening the resin; and detaching the imprinting mold.

Claims (19)

1. An imprinting method, comprising:

coating a resin on a substrate;

aligning an imprinting mold on the resin;

hardening a part of the resin to secure the imprinting mold on the substrate;

pressing the imprinting mold against the resin and the hardened part of the resin;

hardening the remaining resin after the step of pressing; and

detaching the imprinting mold from the hardened resin.

2. The imprinting method of claim 1 , wherein the part of the resin hardened is provided in a plural number.

3. The imprinting method of claim 2 , wherein hardening the part of the resin includes irradiating part of the resin with ultraviolet rays.

4. The imprinting method of claim 3 , wherein irradiating part of the resin comprises:

preparing a shadow mask having a plurality of holes in the imprinting mold;

irradiating ultraviolet rays upon the whole surface of the shadow mask; and

hardening the resin with the ultraviolet rays transmitted through the plurality of holes.

5. The imprinting method of claim 3 , wherein irradiating the ultraviolet rays to the parts of the resin is accomplished through the use of a spot light source.

6. The imprinting method of claim 2 , wherein hardening the parts of the resin includes heating parts of the imprinting mold.

7. The imprinting method of claim 2 , wherein hardening the parts of the resin includes heating parts of the imprinting mold and irradiating the ultraviolet rays to the heated parts of the imprinting mold.

8. The imprinting method of claim 2 , wherein hardening the parts of the resin includes pressing parts of the imprinting mold against the substrate.

9. The imprinting method of claim 1 , wherein pressing the imprinting mold includes pressing the whole surface of the imprinting mold.

10. The imprinting method of claim 1 , wherein pressing the imprinting mold includes sequentially pressing the surface of the imprinting mold.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2012
From: SAMSUNG ELECTRONICS CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029008/0085 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 9, 2008
From: KIM, KYU-YOUNG; PARK, DAE-JIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 020343/0578 →