IP Library Granted Patent US 8,357,980
Granted Patent B2
US 8,357,980 · App. 11/974,746 · Granted Jan 22, 2013

Plasmonic high-speed devices for enhancing the performance of microelectronic devices

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Quick Facts
Patent No.
US 8,357,980
App. No.
11/974,746
Granted
Jan 22, 2013
Kind
B2
Abstract

Various embodiments of the present invention are directed to photonic devices that can be used to collect and convert incident ER into surface plasmons that can be used to enhance the operation of microelectronic devices. In one embodiment of the present invention, a photonic device comprises a dielectric layer having a top surface and a bottom surface, and a planar nanowire network covering at least a portion of the top surface of the dielectric layer. The bottom surface of the dielectric layer is positioned on the top surface of a substrate, and the planar nanowire network is configured to convert incident electromagnetic radiation into surface plasmons that penetrate through the dielectric layer and into at least a portion of the substrate.

Claims (25)

1. A photonic device comprising:

a dielectric layer having a top surface and a bottom surface, the bottom surface of the dielectric layer disposed on a surface of a substrate;

a planar nanowire network covering at least a portion of the top surface of the dielectric layer, the planar nanowire network to convert incident electromagnetic radiation into surface plasmons that form between the planar nanowire network and the dielectric layer, and the dielectric layer having a thickness that enables the surface plasmons to penetrate through the dielectric layer and into at least a portion of the substrate;

a number of radial nanowires, each radial nanowire extends outward from a central region of the planar nanowire network; and

a number of transverse nanowires, each transverse nanowire connects two adjacent radial nanowires, wherein the planar nanowire network has radial symmetry.

2. The photonic device of claim 1 further comprises an anti-reflective coating that covers top and side surfaces of the planar nanowire network and at least a portion of the dielectric layer.

3. The photonic device of claim 1 wherein the planar nanowire network further comprises a metal selected from the group consisting of:

gold;

silver;

copper;

aluminum;

titanium;

platinum: and

an alloy thereof.

4. The photonic device of claim 1 wherein the dielectric layer further comprises a dielectric selected from the group consisting of:

SiO 2 ;

Al 2 ,O 3 ;

Si 3 N 4 ;

a dielectric polymer: and

any other suitable dielectric material.

5. The photonic device of claim 1 wherein the radial nanowires and the transverse nanowires form an approximately polygonal configuration to convert incident electromagnetic radiation into surface plasmons.

6. The photonic device claim 1 wherein substrate further comprises a capacitor.

7. The photonic device of claim 1 wherein the substrate further comprises a gate of a field effect transistor.

8. The photonic device of claim 1 wherein the substrate further comprises a photodiode.

9. The photonic device of claim 1 wherein the substrate further comprises a phototransducer.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2022
From: OT PATENT ESCROW, LLC
To: VALTRUS INNOVATIONS LIMITED
Reel/Frame 060005/0600 →
PATENT ASSIGNMENT, SECURITY INTEREST, AND LIEN AGREEMENT Recorded Jan 26, 2021
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP; HEWLETT PACKARD ENTERPRISE COMPANY
To: OT PATENT ESCROW, LLC
Reel/Frame 055269/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2007
From: WILLIAMS, R. STANLEY; FATTAL, DAVID
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 020033/0845 →