Method of producing an overmolded electronic module with a flexible circuit pigtail
View Patent ↗A method of producing an overmolded electronic assembly including a circuit board and a flexible circuit interconnect by fixturing the assembly in a mold cavity such that a portion of the flexible circuit protrudes from the mold, and providing a compressible elastomeric interface between the mold and the flexible circuit to seal off the mold cavity and protect the flexible circuit from damage due to the clamping force of the mold. The portion of the flexible circuit within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound, and a heat exchanger thermally coupled to the portion of the flexible circuit that protrudes from the mold protects the flexible circuit from damage due to thermal conduction from the mold and mold compound.
1. A method of producing an overmolded electronic assembly, comprising the steps of:
connecting one end of a flexible circuit interconnect to an electronic assembly;
fixturing the electronic assembly and flexible circuit interconnect in a mold cavity defined by upper and lower mold halves such that a portion of said flexible circuit interconnect extends out of said mold cavity and passes between said upper and lower mold halves;
providing an upper compressible elastomeric pad on said upper mold half and a lower compressible elastomeric pad on said lower mold half, and clamping the mold halves together such that said flexible circuit interconnect is sandwiched between said upper and lower compressible elastomeric pads to isolate said flexible circuit interconnect from said mold halves and to seal said mold cavity around said flexible circuit interconnect prior to injection of encapsulant material into said mold cavity;
positioning a heat exchanger adjacent said mold halves for receiving an end portion of said flexible circuit interconnect to remove heat from said flexible circuit interconnect;
positioning a thermal barrier between said heat exchanger and said mold halves;
injecting encapsulant material into said mold cavity to overmold said electronic assembly and a portion of said flexible circuit interconnect;
removing said overmolded electronic assembly from said mold cavity upon curing of said encapsulant material; and
removing said heat exchanger and said thermal barrier when said overmolded electronic assembly is removed from said mold cavity.