IP Library Granted Patent US 7,859,362
Granted Patent B2
US 7,859,362 · App. 11/978,672 · Granted Dec 28, 2010

Branching filter package

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Quick Facts
Patent No.
US 7,859,362
App. No.
11/978,672
Granted
Dec 28, 2010
Kind
B2
Abstract

A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.

Claims (21)

1. A surface acoustic wave (SAW) duplexer comprising:

a transmitting SAW filter having a first input portion and a first output portion;

a receiving SAW filter having a second input portion and a second output portion; and

a single piezoelectric substrate on which the transmitting and receiving SAW filters are arranged in series in an arranging direction,

wherein the single piezoelectric substrate has first and second sides which face each other in an orthogonal direction, the orthogonal direction being orthogonal to the arranging direction,

wherein the first output portion of the transmitting SAW filter is positioned closer to the first side than the second side, and the second input portion of the receiving SAW filter is positioned closer to the second side than the first side,

wherein the single piezoelectric substrate has third and fourth sides which face each other in the arranging direction, and

wherein the first output portion of the transmitting SAW filter is positioned closer to the third side than the fourth side, and the second input portion of the receiving SAW filter is positioned closer to the fourth side than the third side.

2. The surface acoustic wave duplexer according to claim 1 , wherein the first output portion of the transmitting SAW filter is positioned in vicinity to the first side.

3. The surface acoustic wave duplexer according to claim 1 , wherein the second input portion of the receiving SAW filter is positioned in vicinity to the second side.

4. A surface acoustic wave duplexer according to claim 1 , wherein the first input portion of the transmitting SAW filter is positioned closer to the second side than the first side, and the second output portion of the receiving SAW filter is positioned closer to the first side than the second side.

5. The surface acoustic wave duplexer according to claim 1 , wherein the first output portion of the transmitting SAW filter is positioned in vicinity to the third side.

6. The surface acoustic wave duplexer according to claim 1 , wherein the second input portion of the receiving SAW filter is positioned in vicinity to the fourth side.

7. The surface acoustic wave duplexer according to claim 1 , wherein both of the output portion of the transmitting SAW filter and the input portion of the receiving SAW filter are electrically connected to an antenna.

8. The surface acoustic wave duplexer according to claim 7 , wherein the output portion of the transmitting SAW filter is electrically connected to the input portion of the receiving SAW filter outside the single piezoelectric substrate.

9. The surface acoustic wave duplexer according to claim 8 , further comprising:

a first interconnection line which electrically connects the input portion of the receiving SAW filter and the antenna; and

a second interconnection line which electrically connects the output portion of the transmitting SAW filter and the antenna.

10. The surface acoustic wave duplexer according to claim 1 , wherein each of the transmitting SAW filter and the receiving SAW filter comprises a plurality of series-arm SAW resonators and a plurality of parallel-arm SAW resonators.

11. The surface acoustic wave duplexer according to claim 1 , wherein the transmitting SAW filter comprises a plurality of first SAW resonators connected to a ground and wherein the receiving SAW filter comprises a plurality of second SAW resonators connected to the ground.

12. The surface acoustic wave duplexer according to claim 1 , wherein the surface acoustic wave duplexer has characteristic impedance between the approximately 40 ohms and approximately 50 ohms.

Assignments (5)
MERGER Recorded Jan 25, 2016
From: INTELLECTUAL VENTURES FUND 77 LLC
To: INTELLECTUAL VENTURES HOLDING 81 LLC
Reel/Frame 037577/0581 →
CONFIRMATORY ASSIGNMENT Recorded May 8, 2012
From: OHASHI, WATARU; SHIMAMURA, HAJIME; KOMAZAKI, TOMOKAZU; FUJITA, YOSHIAKI
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 028177/0549 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 23, 2012
From: LAPIS SEMICONDUCTOR CO., LTD.
To: INTELLECTUAL VENTURES FUND 77 LLC
Reel/Frame 028093/0534 →
CHANGE OF NAME Recorded Jan 31, 2012
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 027622/0360 →
CHANGE OF NAME Recorded Mar 5, 2009
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022399/0969 →