Branching filter package
View Patent ↗A branching filter package has a SAW filter chip housing area which houses a piezo electric base, on which a transmitting SAW filter and a receiving SAW filter having a different frequency passing band with each other, are formed, and an impedance matching circuit and a branching circuit for the transmitting SAW filter and the receiving SAW filter.
1. A surface acoustic wave (SAW) duplexer comprising:
a transmitting SAW filter having an output portion;
a receiving SAW filter having an input portion;
a single piezoelectric substrate on which the transmitting and receiving SAW filters are formed;
a package base board on which the single piezoelectric substrate is mounted,
an input terminal which is positioned on the package base board and outside the single piezoelectric substrate; and
an output terminal which is positioned on the package base board and outside the single piezoelectric substrate,
wherein the input terminal of the package base board is electrically connected to the input portion of the receiving SAW filter and the output terminal of the package base board is electrically connected to the output portion of the transmitting SAW filter,
wherein a distance between the input terminal and the output terminal of the package base board is greater than a distance between the output portion of the transmitting SAW filter and the input portion of the receiving SAW filter,
wherein the output terminal of the package base board is positioned closer to the output portion of the transmitting SAW filter than the input portion of the receiving SAW filter,
wherein the input terminal of the package base board is positioned closer to the input portion of the receiving SAW filter than the output portion of the transmitting SAW filter, and
wherein the package base board is rectangular, and the input and output terminals are diagonally positioned on the package base board.
2. The surface acoustic wave duplexer according to claim 1 , further comprising:
a first interconnection line which connects the input terminal of the package base board and the input portion of the receiving SAW filter; and
a second interconnection line which connects the output terminal of the package base board and the output portion of the transmitting SAW filter.
3. The surface acoustic wave duplexer according to claim 2 , wherein both of the first and second interconnection lines extend substantially parallel to one direction.
4. The surface acoustic wave duplexer according to claim 1 , wherein a direction from an output portion of the receiving SAW filter to the output terminal of the package base board is different than a direction from an input portion of the transmitting SAW filter to the input terminal of the package base board.
5. The surface acoustic wave duplexer according to claim 4 , wherein the directions are opposite to each other.
6. The surface acoustic wave duplexer according to claim 1 , wherein each of the transmitting SAW filter and the receiving SAW filter comprises a plurality of series-arm SAW resonators and a plurality of parallel-arm SAW resonators.
7. The surface acoustic wave duplexer according to claim 1 , wherein the transmitting SAW filter comprises a plurality of first SAW resonators connected to a ground and wherein the receiving SAW filter comprises a plurality of second SAW resonators connected to the ground.
8. The surface acoustic wave duplexer according to claim 1 , wherein the surface acoustic wave duplexer has characteristic impedance between the approximately 40 ohms and approximately 50 ohms.
9. The surface acoustic wave duplexer according to claim 1 , wherein both of the output portion of the transmitting SAW filter and the input portion of the receiving SAW filter are to be electrically connected to an antenna.
10. The surface acoustic wave duplexer according to claim 9 , wherein the output portion of the transmitting SAW filter is electrically connected to the input portion of the receiving SAW filter outside the single piezoelectric substrate.
11. The surface acoustic wave duplexer according to claim 10 , further comprising:
a first interconnection line which electrically connects the input terminal of the package base board and the antenna; and
a second interconnection line which electrically connects the output terminal of the package base board and the antenna.
12. The surface acoustic wave duplexer according to claim 10 , further comprising:
an antenna terminal disposed on the package base board, the antenna terminal being connected to the antenna,
wherein the output portion of the transmitting SAW filter and the input portion of the receiving SAW filter are electrically connected to the antenna terminal of the package base board.
13. The surface acoustic wave duplexer according to claim 12 , further comprising:
a first interconnection line which electrically connects the input terminal of the package base board and the antenna terminal; and
a second interconnection line which electrically connects the output terminal of the package base board and the antenna terminal.
14. The surface acoustic wave duplexer according to claim 10 , wherein each of the transmitting SAW filter and the receiving SAW filter comprises a plurality of series-arm SAW resonators and a plurality of parallel-arm SAW resonators.
15. The surface acoustic wave duplexer according to claim 10 , wherein the transmitting SAW filter comprises a plurality of first SAW resonators connected to a ground and wherein the receiving SAW filter comprises a plurality of second SAW resonators connected to the ground.
16. The surface acoustic wave duplexer according to claim 10 , wherein the surface acoustic wave duplexer has characteristic impedance between the approximately 40 ohms and approximately 50 ohms.