IP Library Granted Patent US 7,842,525
Granted Patent B2
US 7,842,525 · App. 11/980,432 · Granted Nov 30, 2010

Method and apparatus for personalization of semiconductor

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Quick Facts
Patent No.
US 7,842,525
App. No.
11/980,432
Granted
Nov 30, 2010
Kind
B2
Abstract

A system for making small modifications to the pattern in standard processed semiconductor devices. The modifications are made to create a small variable part of the pattern against a large constant part of the same pattern. In a preferred embodiment the exposure of the variable and constant parts are done with the same wavelength in the same combined stepper and code-writer. The invention devices a way of writing variable parts of the chip that is automatic, inexpensive and risk-free. A system for automatic design and production of die-unique patterns is also shown.

Claims (16)

1. An apparatus for writing information on a workpiece, comprising:

a first exposure system exposing at least one layer of said workpiece; and

a second exposure system exposing the same at least one layer of said workpiece using a spatial light modulator (SLM); wherein

the first and second exposure systems are separate units.

2. The apparatus according to claim 1 , wherein the SLM is an analog SLM.

3. The apparatus according to claim 1 , wherein the first and second exposure systems use the same wavelength.

4. The apparatus according to claim 1 , wherein the first and second exposure systems use different wavelengths.

5. The apparatus according to claim 1 , further comprising:

a control system for controlling at least the second exposure system for writing the information on the workpiece.

6. The apparatus according to claim 5 , wherein the control system includes,

a control system for the first exposure system, the control system controlling initiation of exposure of an exposure field containing the workpiece,

a codewriter control system compiling information about programming for the workpiece, and

a code rasterizing unit for creating a hardware format to be fed to the SLM for the workpiece.

7. The apparatus according to claim 1 , wherein the first and second exposure systems are operable for at least partly simultaneous exposure of the workpiece.

8. The apparatus of claim 1 , wherein the second exposure system is an independent code-writer.

9. The apparatus of claim 8 , wherein the second exposure apparatus is an independent code-writer without the possibility of simultaneous exposure of the workpiece.