Method for manufacturing flexible display substrate and flexible display device

1. A method for manufacturing a flexible electrophoretic display device, comprising:

providing a metal mother substrate having a first thickness, including a unit display panel region and a non-display region adjacent the unit display panel region;

forming a display element in the unit display panel region;

forming a photoresist pattern exposing a portion of the non-display region;

etching the mother substrate to form a groove according to the portion of the non-display region exposed by the photoresist pattern;

cutting the mother substrate along the groove to separate the unit display panel region from the mother substrate;

thinning the substrate of the separated unit display panel region; and

forming an electrophoretic ink film on the unit display panel region.

2. The method according to claim 1 , wherein the first thickness is greater than about 0.3 mm.

3. The method according to claim 2 , wherein thinning the substrate includes thinning to less than about 70% of the first thickness.

4. The method according to claim 1 , wherein thinning the substrate includes etching the substrate.

5. The method of claim 4 , wherein etching the substrate includes wet etching with an etchant including an halogen element.

6. The method according to claim 4 , wherein etching the substrate includes dipping the substrate or spraying the substrate.

7. The method according to claim 1 , further comprising grinding edges of the substrate of the separated unit display panel region.

8. The method according to claim 1 , wherein foiming the electrophoretic ink film includes:

forming a common electrode;

forming a microcapsule layer; and

forming a protection layer.

9. A method for manufacturing a flexible electrophoretic display device, comprising:

providing a metal mother substrate having a first thickness such that the mother substrate is substantially inflexible, including a unit display panel region and a non-display region adjacent the unit display panel region;

forming a display element in the unit display panel region;

forming a photoresist pattern exposing a portion of the non-display region;

etching the mother substrate to form a groove according to the portion of the non-display region exposed by the photoresist pattern;

cutting the mother substrate along the groove to separate the unit display panel region from the mother substrate;

thinning the substrate of the separated unit display panel region such that the thinned substrate has a flexible characteristic; and

forming an electrophoretic ink film on the unit display panel region.

10. The method according to claim 9 , wherein forming the electrophoretic ink film includes:

forming a common electrode;

forming a microcapsule layer; and

forming a protection layer.

11. A method for manufacturing a flexible electrophoretic display device, comprising:

providing a metal mother substrate having a first thickness, including a unit display panel region and a non-display region adjacent the unit display panel region;

forming a display element in the unit display panel region;

forming a photoresist pattern exposing a portion of the non-display region;

etching the mother substrate to form a groove according to the portion of the non-display region exposed by the photoresist pattern;

cutting the mother substrate along the groove to separate the unit display panel region from the mother substrate;

thinning the substrate of the separated unit display panel region; and

forming an electrophoretic ink film on the unit display panel region.

12. The method according to claim 11 , wherein forming the electrophoretic ink film includes:

forming a common electrode;

forming a microcapsule layer; and

forming a protection layer.

13. A method for manufacturing a flexible display substrate, comprising:

providing a metal mother substrate having a first thickness, including a unit display panel region and a non-display region adjacent the unit display panel region;

forming a display element in the unit display panel region;

forming a groove in the non-display region of the mother substrate;

cutting the mother substrate along the groove to separate the unit display panel region from the mother substrate; and

thinning the substrate of the separated unit display panel region.

14. The method of claim 13 , wherein a depth of the groove is most of a thickness of the mother substrate.

15. The method of claim 13 , wherein the display element and the groove are formed on a first side of the mother substrate.

16. The method of claim 13 , wherein cutting the mother substrate includes irradiating a laser beam along the groove in the non-display region of the mother substrate.

17. The method of claim 13 , wherein a plurality of grooves are formed in a non-display region of the mother substrate between adjacent unit display panel regions.